Polishing pad and chemico-mechanical polishing method

A chemical machinery, polishing pad technology, applied in surface polishing machine tools, grinding/polishing equipment, electrical components, etc., can solve the problems of difficult to pull out the wafer, the surface of the wafer cannot meet the application requirements, etc., and achieve high surface flatness degree of effect
CN101190508AInactive Publication Date: 2008-06-04SEMICON MFG INT (SHANGHAI) CORP +1
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
SEMICON MFG INT (SHANGHAI) CORP
Publication Date
2008-06-04
Estimated Expiration
Not applicable Β· inactive patent

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Abstract

The invention provides a polishing pad; the polishing surface of the polishing pad is provided with a plane area and a concave / convex area; the plane area is a flat surface with the coarseness less than 20 Mu m used for polishing wafer; the concave / convex area is provided with troughs or holes or the combination of the troughs and holes used for pulling the wafer out of the polishing surface. By adopting the polishing pad provided by the invention, the wafer after chemically and mechanically polished has high surface smoothness; after the polishing is finished, the wafer is moved to the concave / convex area of the polishing pad and the wafer is easy to be pulled out of the surface of the polishing pad.
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Description

technical field

[0001] The invention relates to a semiconductor chemical mechanical polishing process, in particular to a chemical mechanical polishing pad and a chemical mechanical polishing method for high flatness of the wafer surface. Background technique

[0002] The chemical mechanical polishing (CMP) process was introduced into the integrated circuit manufacturing industry by IBM in 1984, and was first used in the planarization of the intermetallic insulating dielectric (IMD) in the subsequent process, and then used for tungsten (W) through the improvement of equipment and processes. planarization for shallow trench isolation (STI) and copper (Cu) planarization. Chemical Mechanical Polishing (CMP) is the fastest growing and most important technology in IC manufacturing process in recent years.

[0003] The CMP polishing process uses mechanical force to act on the surface of the wafer in the atmospheric environment of the clean room, and generates power to break and c...

Claims

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