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Mixed microstrip line device for suppressing electromagnetic radiation of dual-band mobile telephone

A technology of electromagnetic radiation and microstrip line, which is applied to the structure of radiation elements, antennas, electrical components, etc., and can solve problems such as electromagnetic radiation and excessive mobile phone calls.

Inactive Publication Date: 2008-07-02
NORTHWESTERN POLYTECHNICAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

While mobile phones bring convenience to people, due to design and use reasons, excessive electromagnetic radiation is generated when mobile phones are used, resulting in many negative effects

Method used

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  • Mixed microstrip line device for suppressing electromagnetic radiation of dual-band mobile telephone
  • Mixed microstrip line device for suppressing electromagnetic radiation of dual-band mobile telephone
  • Mixed microstrip line device for suppressing electromagnetic radiation of dual-band mobile telephone

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Metal copper is formed on the surface of the microwave substrate by etching or printing techniques to complete the production of left / right hand mixed microstrip lines. The specific preparation process is as described in the embodiment. The relevant parameters of the microstrip line are set as: h=1.50mm, ε=4.65 (epoxy resin glass cloth), d=8.00mm, g=0.90mm, w=2.80mm, n=8, t=0.018mm, Φ = 1.50mm and D = 8.80mm. A series of chip inductors with package number 0603 L L Welded between the metal conduction strip and the metal grounding plate in parallel; at the same time, a series of chip capacitors C with package number 0805 L Connected in series between adjacent metal conduction strips, the two ends of the chip capacitor are respectively welded to the ends of the two sections of conduction strips, and assembled just above the gap. Depend on image 3 Shown, C L =5.1pF, L L =4.7nH The combined left / right hand hybrid microstrip line has an extremely wide stop band in the f...

Embodiment 2

[0024] Similar to Example 1, metal copper is formed on the surface of the microwave substrate by etching or printing techniques to complete the production of the left / right hand mixed microstrip line, and the specific preparation process is as described in the embodiment. The relevant parameters of the microstrip line are set as: h=1.50mm, ε=4.65 (epoxy resin glass cloth), d=8.00mm, g=0.90mm, w=2.80mm, n=8, t=0.018mm, Φ = 1.50mm and D = 8.80mm. A series of chip capacitors C with package number 0805 L Connected in series between adjacent metal conduction strips, the two ends of the chip capacitor are respectively welded to the ends of the two sections of conduction strips, just above the gap; at the same time, a series of chip inductors with package number 0603 L L Soldered in parallel between the metal conductive strip and the metal ground plate. still by image 3 Know, C L =2.0pF, L L =10.0nH The combined left / right hand mixed microstrip line has a wide stop band in the ...

Embodiment 3

[0026] Metal copper is formed on the surface of the microwave substrate by etching or printing techniques. The specific preparation process is as described in the embodiment. The basic structural unit used in this embodiment is a microstrip line loaded with chip inductors only. The relevant parameters of the microstrip line are set as: h=1.50mm, ε=4.65 (epoxy glass cloth), d=6.00mm, g=0.80mm, w=2.80mm, n=6, t=0.018mm, Φ = 1.50mm and D = 8.80mm. A series of package numbers are 0603, L L =1.0nH chip inductors are soldered in parallel between the metal copper conductive strip and the ground plate. SMD inductor L L 1.8nH, 2.2nH can also be used. Figure 4 It is the microwave transmission curve of the microstrip line loaded with chip inductors. It can be seen from the figure that for the inductances of 1.0nH, 1.8nH and 2.2nH, the electromagnetic band gap less than -50dB appears in the frequency band below 2000MHz, which can completely cover the mobile phone. Dual frequency work...

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Abstract

The invention relates to a compound microstrip line device for inhibiting the electromagnetic radiation of a double frequency mobile. The device comprises a microstrip line, a patch inductor LL, a patch capacitor CL, a metal receiving plate, a corner microstrip line, a taper microstrip line, a grounding spot, a U shape metal belt and two blocks of external metal conduction tablets. A microwave LC loop is formed by the metal receiving plate, the compound microstrip line of left / right and the grounding spot of the device, which is capable of consuming the excess electromagnetic radiation of the mobile phone, so as to reduce the damage to the brain of mobile phone users. The invention is manufactured by adopting low cost materials like the patch capacitor, the patch inductor, the metal copper sheet conductor and microstrip line. The invention has the advantages of low manufacturing cost, easy assembling and convenient for embedding into the double frequency mobile.

Description

technical field [0001] The invention relates to a hybrid microstrip line device for suppressing electromagnetic radiation of a dual-frequency mobile phone. Background technique [0002] In recent years, the personal communication industry has risen rapidly. Only the Global System Mobile Service (GSM) has opened up several frequency bands, including GSM900MHz and GSM1800MHz (DCS). While mobile phones bring convenience to people, due to design and use reasons, excessive electromagnetic radiation is produced during mobile phone calls, resulting in many negative effects. The field strength test shows that the main radiation source of the mobile phone is the antenna, which has excessive electromagnetic radiation in its near-field area. Under the design trend of thinner and lighter mobile phones, multi-functionality and built-in antennas, how to ensure the quality of calls and effectively reduce the damage caused by mobile phone electromagnetic radiation to users has become an ur...

Claims

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Application Information

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IPC IPC(8): H01Q13/08H01Q1/38
Inventor 赵晓鹏介晓永安涛李明明罗春荣
Owner NORTHWESTERN POLYTECHNICAL UNIV
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