Unlock instant, AI-driven research and patent intelligence for your innovation.

Circuit board level self-test system

A technology of circuit testing and self-testing, which is applied in the electronic field and achieves the effect of outstanding practicability

Inactive Publication Date: 2011-07-20
UNIV OF ELECTRONICS SCI & TECH OF CHINA
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Aiming at the detection and fault diagnosis of complex and high-density circuit boards, the present invention provides a circuit board-level self-inspection system, which provides an efficient technical approach for the maintenance of high-density circuit boards, especially for field mobile Circuit boards in places where it is not easy to obtain external test equipment on site, such as aviation, aerospace and deep sea, propose a technical measure to realize fault self-detection and self-diagnosis

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit board level self-test system
  • Circuit board level self-test system
  • Circuit board level self-test system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0039] Embodiment 1: A circuit board-level self-inspection system that uses a "microprocessor" to form a circuit inspection subsystem.

[0040] like image 3As shown, the circuit detection subsystem is composed of a microprocessor, a power supply / clock module, an input / output interface module and a display module. The power supply / clock module provides working power and clock control signals for the microprocessor; the display module is connected to the microprocessor through an input / output interface module to provide a display of the test process or test results for the circuit detection subsystem; the The microprocessor is composed of a main control module, a test control module and a data analysis module (such as Figure 7 shown), the input / output interface module is connected to the main control module through address, data and control buses. The remote or local test control signal / command is input to the main control module through the input / output interface module thr...

Embodiment approach 2

[0043] Embodiment 2: A circuit board-level self-inspection system that uses a "microprocessor + co-controller" to form a circuit inspection subsystem.

[0044] like Figure 5 As shown, the circuit detection subsystem is composed of a microprocessor, a co-controller, a power supply / clock module, an input / output interface module and a display module. The power supply / clock module provides operating power and clock control signals for the microprocessor and co-controller; the display module is connected with the microprocessor through the input / output interface module, and provides information on the test process or test results for the circuit detection subsystem. show. like Figure 8 As shown, the co-controller is composed of a control part and a test excitation signal output / test response signal receiving part, and the control part of the co-controller communicates with the test excitation signal output / test of the microprocessor and the co-controller respectively The respo...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to circuit fault detection and diagnosis, in particular to the test and fault diagnosis of integrated circuit, belonging to electric technical field. The invention comprises a circuit detection subsystem and an object circuit which are connected via a test bus, wherein the object circuit is provided with a test channel provided as testable design standard, the circuit detection subsystem and the object circuit are integrated on one circuit board, the circuit detection subsystem can be composed of a microprocessor or composed of a microprocessor and an assist controller, the circuit detection subsystem can comprise communication module to provide communication function or comprise a memory to provide extended memory space. The invention embeds a circuit detection system on an object circuit board to realize the automatic test on the circuit board, which can effectively maintain high-density circuit board. The invention has high practicality in the circuit board test in the conditions as wild and remote area lack of external test devices.

Description

technical field [0001] The invention belongs to the field of electronic technology, and relates to circuit fault detection and diagnosis technology, in particular to integrated circuit test and fault diagnosis. Background technique [0002] Microelectronics technology has entered the era of System-On-a-Chip (SOC for short). The integration level of a single chip is still growing rapidly, and the functions are continuously increasing and enhancing. With the relentless pursuit of small size, light weight and other indicators in the application of electronic products and the continuous promotion of manufacturing technology, the geometric size of a single chip is constantly decreasing, while the number of pins is constantly increasing. At the same time, advanced packaging technologies emerge in an endless stream, making the complexity of printed circuit boards higher and higher. The difficulty and cost of testing and diagnosing circuit boards using traditional testing methods ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/28G08C17/00G08C19/00
Inventor 谢永乐
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More