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Ultra-high dielectric constant multilayer ceramic capacitor medium and preparation method thereof

A technology for capacitor dielectrics and multilayer ceramics, which is applied in the direction of fixed capacitor dielectrics, ceramics, and components of fixed capacitors. and other problems, to achieve the effect of low loss, low sintering temperature and low cost

Inactive Publication Date: 2010-05-19
TIANJIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] At present, most of the X8R series capacitor ceramic dielectric materials developed at home and abroad use BaTiO 3 Based on the material system, its room temperature dielectric constant is less than 4000, it is difficult to continue to improve, and the firing temperature is high (above 1200), which cannot meet the requirements of miniaturization, high performance and low cost of ceramic capacitors

Method used

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  • Ultra-high dielectric constant multilayer ceramic capacitor medium and preparation method thereof
  • Ultra-high dielectric constant multilayer ceramic capacitor medium and preparation method thereof
  • Ultra-high dielectric constant multilayer ceramic capacitor medium and preparation method thereof

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Embodiment Construction

[0023] The present invention will be further described below in conjunction with embodiment.

[0024] best practice

[0025] The present invention adopts analysis pure raw material, at first prepares glass powder, by the Bi of 20wt% 2 o 3 , 28wt% Pb 3 o 4 , 22wt% ZnO, 17wt% TiO 2 , 13wt% H 3 BO 3 Ingredients, fully mixed, melted and quenched, ground for 28 hours, sieved to obtain glass powder; then the ultrafine BaTiO 3 The powder is pretreated and pre-fired at 1100°C for 3 hours. Take the pre-burned BaTiO 3 Powder material 50g, add additive according to the formula: 3.5wt% Nb 2 o 5 , 0.4wt% MgCO 3 , 0.15wt% MnCO 3 , 20wt% Ag 2 O, 12wt% glass powder, 0.4wt% rare earth oxide Gd 2 o 3 .

[0026] According to the raw material: ZrO 2 Balls: put deionized water in a weight ratio of 1:5:1.7 into a ball mill jar, put it on a planetary ball mill, the speed of the ball mill is 400r / min, and mill for 4 hours; dry in an infrared drying oven; The heating rate is raised t...

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Abstract

The invention discloses a multiple-layer ceramic capacitor medium with super-dielectric constants. The percentage contents of raw material component and weight are that BaTiO3 takes 100%, in additional adding 3-4% Nb2O5, 0.3-0.5% MgCO3, 0.1-0.2% MnCO3, 18-22%Ag2O and 10-13% glass powder, and 0.2-0.7% one rare-earth oxide of Y2O3, Gd2O3 Ho2O3, the percentage contents of raw material component and weight of the glass powder are that Bi2O3 takes 10-30%, Pb3O4 takes 20-30%, ZnO takes 20-30%, TiO2 takes 10-20% and H3BO3 takes 10-20%. The preparing steps comprises (1) pre-treating BaTiO3 powder, (2) proportioning, (3) ball milling according to the weight proportion of the raw material, ZrO2 ball and de-ionized water of 1:5:1.7, (4) drying, (5) pre-sintering, (6) pelleting and pressing to greencompact and (7) calcining. The invention provides a multiple-layer ceramic capacitor medium material which is high in dielectric constants, low in sintering temperature, low in loss and cost and finein property.

Description

technical field [0001] The invention relates to electronic components, in particular to an ultra-high dielectric constant multilayer ceramic capacitor dielectric material and a preparation method thereof. Background technique [0002] With the rapid development of radio communication technology, satellite broadcast communication, satellite ground receiving system, aviation and aerospace technology, it is required to develop electronic equipment with better performance, smaller volume and wider frequency band. The components that make up these electronic devices require miniaturization, miniaturization, light weight and chip type to meet the needs of surface mount technology (SMD) of electronic components. Among all kinds of electronic components, multilayer ceramic capacitors (MLCC for short) are the most widely used type of chip components. When the structure and process conditions (including electrode area, stack number and dielectric film thickness) are determined, the c...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G4/12H01B3/12C04B35/468C04B35/622
Inventor 李玲霞张平王瓛王洪茹张志萍
Owner TIANJIN UNIV