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Cu-Al2O3 nano strengthened dispersion alloy and preparation method thereof

A dispersion-strengthening, cu-al2o3 technology, applied in the field of Cu-Al2O3 nano-dispersion-strengthening alloy and its preparation, can solve the problems of stuck float, not given, inflexible rotation of float, etc., and achieves simple process method and improved conductivity , The effect of excellent high temperature softening ability

Active Publication Date: 2008-08-13
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the field of inertial instruments, the materials used for sensor rotors, etc. not only need to have high strength, but also the material can maintain high strength after being annealed at 900 ° C, so as to prevent its deformation from rubbing against the float and the stator. Rotation is inflexible, or even the float is stuck, which will also lead to the output accuracy and reliability of the gyroscope, and the material is required to have high electrical conductivity, and the electrical conductivity should be higher than 96% IACS, but in the above patents, none of them are given. Cu-Al with conductivity higher than 96% IACS 2 o 3 Alloy composition and preparation process

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Example 1: The alloy composition is Al 2 O3 -0.055wt%, the rest is Cu and unavoidable impurities. According to the process steps of the method (1) to (6) of the present invention, a hot pressed billet of Φ195 is made. Cu-Al 2 O 3 The relative density of the compact after the alloy powder control density cold isostatic pressing is 70%. The sheathed compact after the secondary reduction of hydrogen is heated to 950℃ under the protection of nitrogen and extruded into Φ36 bar (extrusion ratio 30:1), and cold forged to Φ25 bar, cold drawn bar After 900℃ / 1h hydrogen protection annealing, the measured properties of the alloy are shown in Table 1.

[0029] Table 1

[0030] σ b

Embodiment 2

[0031] Example 2: The alloy composition is Al 2 O 3 -0.05wt%, the rest is Cu and unavoidable impurities. According to the process steps of the method (1) to (6) of the present invention, a hot pressed billet of Φ195 is made. Cu-Al 2 O 3 The relative density of the compact after the alloy powder control density cold isostatic pressing is 70%. The sheathed compact after the secondary reduction of hydrogen is heated to 950℃ under the protection of nitrogen and extruded into Φ36 bar (extrusion ratio 30:1), and cold forged to Φ25 bar, cold drawn bar After hydrogen protection annealing at 900℃ for 1h, the measured properties of the alloy are shown in Table 2.

[0032] Table 2

[0033] σ b

Embodiment 3

[0034] Example 3: The alloy composition is Al 2 O 3 -0.05wt%, the rest is Cu and unavoidable impurities. According to the process steps of the method (1) to (6) of the present invention, a hot pressed billet of Φ195 is made. Cu-Al 2 O 3 The relative density of the compact after the alloy powder control density cold isostatic pressing is 70%. The sheathed compact after the secondary reduction of hydrogen is heated to 950℃ under the protection of nitrogen and extruded into a Φ36 bar (extrusion ratio 30:1), and cold forged to a Φ20 bar, cold drawn bar After hydrogen protection annealing at 900℃ for 1h, the measured properties of the alloy are shown in Table 3.

[0035] table 3

[0036] σ b

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PUM

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Abstract

The invention relates to a Cu-Al2O3 nanometer dispersion strengthening alloy and preparation thereof. The preparation includes the steps of Cu-Al alloy vacuum smelting, pulverizing, screening, internal oxidizing, hydrogen reducing, vacuum hot pressing, canned hot extruding, etc. Comparing with oxygen-free copper, sigma of the alloy of the invention is 2 to 6 times higher that of the oxygen-free copper, the anti-annealing softening temperature is up to over 900 DEG C, the conductivity is up to 96% IACA and more. The process of the invention is simple, the prepared Cu-Al2O3 nanometer dispersion strengthening alloy has high strength, high conductivity, electrical conductivity higher than 96% IACA, and is anti-annealing and antimagnetic. The alloy can not only used for large-scale integrated circuit lead frame, manufacturing of controlled thermonuclear reaction heat sink components, and is expecially suitable for manufacturing of microwave tube grid mesh, inertial instrument sensor, particle accelerator and other high-precise parts.

Description

Technical field [0001] The invention relates to a Cu-Al 2 O 3 A nano-dispersion strengthened alloy and a preparation method thereof belong to the technical field of nano-alloy materials. Background technique [0002] The annealed pure copper (such as C10100, TU1, etc.) has high conductivity (98~102%IACS), but its strength is too low (σ 0.2 Only 40MPa), due to its low yield strength, the oxygen-free copper is easily deformed. The high-conductivity copper alloys developed in recent years, such as Cu-Zr, Cu-B, Cu-Ag, etc., have a conductivity of more than 98% IACS, but after high-temperature annealing and stabilization, σ 0.2 It can only reach 80Mpa, and the yield strength is low, which affects its industrial application. Precipitation-strengthened copper alloys, such as Cu-Cr-Zr, Cu-Ni-Si, Cu-Fe-P, etc., although the strength index can reach σ under the cold working aging state b =500MPa,σ 0.2 =450MPa, but the conductivity is low, only about 75% IACS. After the high temperature ann...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/01C22C1/10C22C1/05C22C1/02B22F9/08B22F3/20
Inventor 李周汪明朴郭明星龚深肖柱
Owner CENT SOUTH UNIV
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