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Metal carriage belt of intelligent card, its making and encapsulation module including this carrying belt

A technology for encapsulating modules and smart cards, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc., and can solve the problems of high packaging cost, complicated process, and high cost of organic carrier tape

Inactive Publication Date: 2008-08-13
SAMSUNG ELECTRONICS CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the manufacturing process of the organic substrate requires multiple process steps such as gluing, covering copper foil lamination, etching, nickel-gold plating, etc., the process is complex, and the cost of the organic carrier tape is high, resulting in high packaging costs
Currently, the production cost of smart card carrier tape exceeds 50% of the total packaging material cost

Method used

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  • Metal carriage belt of intelligent card, its making and encapsulation module including this carrying belt
  • Metal carriage belt of intelligent card, its making and encapsulation module including this carrying belt
  • Metal carriage belt of intelligent card, its making and encapsulation module including this carrying belt

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Embodiment Construction

[0022] Hereinafter, the present invention will be described more fully with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown. However, this invention may be embodied in many different ways and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the principles of the invention to those skilled in the art. In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity.

[0023] In the drawings, the same reference numerals denote the same elements throughout. Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0024] FIG. 1 is a schematic diagram showing a metal carrier tape of a smart card according to an exemplary embodiment of the present invention, and FIG. 2 is a schematic st...

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Abstract

The invention provides a smart card metal carrier band and manufacturing approach, as well as packaging module including the carrier band. The smart card carrier band includes a plurality of smart card carrier band units, each of them includes: a base plate which is made of the metal material; A bonding pad forming on the upper surface of the base plate on which is about to arrange the chip; a nickel layer forming on the lower surface and in the bonding pad of the base plate; a gold layer forming on the nickel layer.

Description

technical field [0001] The present invention relates to a smart card carrier tape and its manufacturing method and a packaging module including the smart card carrier tape, more specifically, the present invention relates to an all-metal smart card carrier tape and its manufacturing method and the all-metal smart card carrier tape with packaged modules. Background technique [0002] At present, most of the carrier tapes used in smart card packaging are organic substrates. However, the manufacturing process of the organic substrate requires multiple process steps such as gluing, copper foil covering, etching, nickel-gold plating, etc. The process is complex, and the cost of the organic carrier tape is high, resulting in high packaging costs. Currently, the production cost of smart card carrier tape exceeds 50% of the total cost of packaging materials. Therefore, in order to further reduce the cost of smart card packaging, it is necessary to develop a low-cost carrier tape. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/498H01L21/48
CPCH01L2224/48091H01L2224/48228H01L2224/49171H01L2224/73265H01L2924/00014H01L23/48H05K13/02
Inventor 黄玉财
Owner SAMSUNG ELECTRONICS CO LTD