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Radiating assembly and thermal pipe thereof

A technology of heat dissipation components and heat pipes, applied in the direction of tubular components, electrical components, heat exchange equipment, etc., can solve the problems of accelerated aging of the casing, small internal space of electronic products, and heat dissipation problems, so as to improve the service life and avoid rapid aging Effect

Inactive Publication Date: 2008-09-03
ASUSTEK COMPUTER INC
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Problems solved by technology

However, with the continuous improvement of the speed of microprocessors and peripheral hardware functions, while the internal space of electronic products is becoming increasingly narrow, it is also facing the problem of heat dissipation caused by the internal electronic components.
[0003] The common heat pipe (heat pipe) is a kind of heat dissipation element widely used in electronic products. However, in the process of transferring heat energy from the heat pipe, the electronic components around the heat pipe are often easily affected by the high temperature on the surface of the pipe body. In addition, the casing near the heat pipe may also accelerate aging due to long-term high temperature

Method used

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  • Radiating assembly and thermal pipe thereof
  • Radiating assembly and thermal pipe thereof
  • Radiating assembly and thermal pipe thereof

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Embodiment Construction

[0020] First please refer to FIG. 1 , the heat dissipation component in this embodiment is disposed on a circuit board S inside an electronic device for heat dissipation. As shown in the figure, the aforementioned heat dissipation assembly mainly includes a thermal interface material 10 (Thermal Interface Material, TIM), a heat pipe 20 and a heat sink 30 (heat sink), wherein the thermal interface material 10 is close to a heat source on the circuit board S ( For example, CPU), the heat pipe 20 connects the heat junction surface 10 and the heat sink 30, and a working fluid in the heat pipe 20 can quickly transfer heat energy from the heat junction surface 10 to the heat sink 30 to achieve the effect of heat dissipation. In a preferred embodiment, the thermal junction surface 10 can be made of a metal material with good heat conduction efficiency. In addition, a plurality of fins 31 can be arranged on the heat sink 30 to increase the heat dissipation area and enhance the heat dis...

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Abstract

The invention discloses a radiating assembly, which is suitable for an electronic device, includes a thermojunction, a radiator and a heat pipe. The thermojunction closes to a heat source in the electronic device. The heat pipe is connected with the thermojunction and the radiator, wherein the heat pipe includes a tubular body and a casing which wraps around the tubular body, a vacuum layer is formed between the casing and the tubular body to prevent insulation conduction and thermal convection.

Description

technical field [0001] The invention relates to a heat dissipation assembly, in particular to a heat dissipation assembly with a vacuum layer heat pipe. Background technique [0002] With the advancement of computer technology and the popularization of electronic products, various types of electronic products have gradually evolved towards light, thin, short and small. However, as the speed of microprocessors and peripheral hardware functions continue to increase, while the internal space of electronic products is becoming increasingly narrow, they are also facing the problem of heat dissipation generated by the internal electronic components. [0003] The common heat pipe (heat pipe) is a kind of heat dissipation element widely used in electronic products. However, in the process of transferring heat energy from the heat pipe, the electronic components around the heat pipe are often easily affected by the high temperature on the surface of the pipe body. In addition, the c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20G06F1/20H01L23/427F28F1/00
Inventor 张木财康兆锋
Owner ASUSTEK COMPUTER INC
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