Method for making printed circuit board and etched half-finished circuit board

Abstract

The invention discloses a method for manufacturing a printed wiring board and an etched semi-finished wiring board. The method at least comprises the steps as follows: a. exposing; b. developing: a protective film is caused to form on each unit plate of the wiring board, and the protective film forms a circuit pattern, protective films are also caused to form on at least some parts of connection areas between the unit plates and frame areas of the wiring board; c. etching: an erosion nozzle sprays erosive liquid to the wiring board to erode an exposed base copper on the wiring board, and circuit patterns are etched on the unit plates of the wiring board while at least some part of the base copper in the frame areas of the wiring board and the connection areas between the unit plates is reserved; by adopting the method, the base copper is still reserved on the surfaces of two sides of either the connection areas or the frame areas of the etched semi-finished wiring board so as to form an reinforced copper block. In the etching and follow-up procedures of the wiring board, the strength and rigidity of the wiring board are improved, with low breakdown rate and high product qualification rate.

Description

technical field [0001] The invention relates to a manufacturing method of a printed circuit board and an etched semi-finished circuit board. Background technique [0002] At present, all kinds of electronic products are constantly developing in the direction of low power consumption, multi-function, and high reliability, but the size of the products is constantly tending to be miniaturized, even miniaturized. During the processing of various electronic products, often Printed circuit boards are used, and circuit boards play a very critical role as the carrier of electronic components. In order to meet the requirements of high density, number of layers and thinner thickness of the circuit board, a thinner inner core board is used in the production process. The thickness of the thin core board is much lower than the conventional lower limit of 0.13mm, as thin as 0.05-0.10 mm, the structure of the thin core board before processing is as figure 1 As shown, it includes the diel...

AI Technical Summary

Problems solved by technology

[0003] When the thickness of the dielectric layer of the core board is less than 0.13mm, it becomes very difficult to develop, etch and remove the film in the process of making the inner layer pattern of the circuit board, especially in the current processing technology, the circuit pattern is placed on the circuit board The base copper in the other areas is corroded, making the core board softer. After etching and subsequent steps, it is very easy to be impacted by the high-pressure spray liquid and curled into the roller, causing the product to be scrapped.

It can be seen that during the processing of the thin core board, the thin core board is easily damaged when processed according to the conventional process, and its pass rate is very low.

Images