Radiation-sensitive compositions and imageable materials

A radiation-sensitive composition technology, applied in the field of radiation-sensitive compositions and imageable materials, can solve the problems of reducing photosensitive speed and operating cycle, reducing production yield, weak printing effect, etc.

Inactive Publication Date: 2008-10-08
EASTMAN KODAK CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, we have found that the resulting dried coatings containing polymerized urethane acrylate may be undesirably tacky, which reduces production yields
Attempts to eliminate this problem include reducing coating thickness, but this leads to other problems and reduces overall printing plate performance, including reduced photospeed and run time and lighter print

Method used

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  • Radiation-sensitive compositions and imageable materials
  • Radiation-sensitive compositions and imageable materials
  • Radiation-sensitive compositions and imageable materials

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1 and 2

[0151] The radiation-sensitive composition described in Table I below was coated on the treated aluminum substrate to give a dry coating weight of 1.0 g / m 2 or 1.5g / m 2 , containing polymer E (Example 1) or B (Example 2) in the coating. The composition was coated with a winding rod and dried in an open chain oven set at 90°C for about 45 seconds. The aluminum base plate was brushed and phosphoric acid anodized and post-treated with polyacrylic acid.

[0152] Table I

[0153]

[0154] 1 Polymers E and B are 60 wt.% in MEK / DMAC 80:20, the acid value of polymer E is 12.8 mg KOH / g polymer E, and the acid value of polymer B is 12.6 mg KOH / g polymer E.

[0155] The resulting coating has a dry coating weight of 1.0 g / m 2 The printing plate precursors used in Examples 1 and 2 were at 300mJ / cm 2 The bottom is imaged on the traditional Creo Trendsetter 3244x imagesetter, and then directly installed on the traditional Komori press. Select printing conditions that accelerate pla...

Embodiment 3

[0160] The radiation-sensitive composition described in Table II below was coated on the treated aluminum substrate to give a dry coating weight of 1.0 g / m 2 , containing polymer D in the coating. The composition was coated with a winding rod and then dried in a Ranar open chain oven set at 90°C for about 45 seconds. The aluminum substrates were electrochemically grained and phosphoric acid anodized and post-treated with polyvinylphosphonic acid.

[0161] Table II

[0162]

[0163] 1 Polymer D is 55 wt.% in MEK / DMAC 82 / 18 and has an acid value of 41.5 mgKOH / g.

[0164] The resulting plate precursor used in Example 3 was imaged and developed on-press as in Examples 1 and 2 above. On-press development of the plate was poor, and printing was stopped after 1,000 copies were printed due to insufficient development.

[0165] In the viscosity evaluation, the printing plate precursor lifted to a height of <1 inch (2.54 cm) before falling to the table.

[0166] While improving t...

Embodiment 4 and 5

[0168] The radiation-sensitive composition described in Table III below was coated on the treated aluminum substrate to give a dry coating weight of 1.0 g / m 2 , Polymer A (Example 4) or Polymer C (Example 5) was included in the coating. The composition was coated with a winding rod and then dried in a Ranar open chain oven set at 90°C for about 45 seconds. The aluminum substrates were electrochemically grained as well as phosphoric acid anodized and post-treated with polyvinylphosphonic acid.

[0169] Table III

[0170]

[0171] n-propanol

51.72

2-butanone

18.40

water

13.44

[0172] 1 Polymer A was a 60 wt.% solution in MEK / DMAC 80:20 and Polymer C was a 60 wt.% solution in MEK / DMAC 83:17. The acid value of polymer A was 41.5 mg KOH / g polymer A, and the acid value of polymer C was 44.2 mg KOH / g polymer C.

[0173] The resulting plate precursors used in Examples 4 and 5 were imaged and developed on-press as in Examples 1 ...

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Abstract

A radiation-sensitive composition includes a radically polymerizable component that comprises carboxy groups, an initiator composition to generate radicals, and a polymeric binder comprising poly(alkylene oxide) segments and optionally pendant cyano groups. This composition can be used to prepare imageable elements such as negative-working, on-press developable printing plate precursors.

Description

technical field [0001] The present invention relates to radiation sensitive compositions and imageable materials such as negative working on-press developable printing plate precursors. More particularly, the present invention relates to radiation sensitive compositions and imageable materials comprising improved polymerizable components that provide low tack coatings. The invention also relates to methods of using these compositions and imageable materials. Background technique [0002] Radiation-sensitive compositions are commonly used in the preparation of imageable materials including lithographic printing plate precursors. Such compositions generally include a radiation sensitive component, an initiator system, and a binder. Each component has been the focus of research to provide improvements in various physical properties, and thus imaging performance. [0003] Recent developments in the field of printing plate precursors have focused on the use of radiation-sensit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/027G03F7/029G03F7/033
CPCY10S430/106G03F7/033Y10S430/111G03F7/027G03F7/029B41C1/1008B41C2210/04B41C2210/08B41C2210/266
Inventor S·萨赖亚H·M·蒙内利F·E·米克尔K·D·维兰
Owner EASTMAN KODAK CO
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