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Method for attachment of solder powder to electronic circuit board and soldered electronic circuit board

An electronic circuit board and solder powder technology, which is applied to the assembly of printed circuits with electrical components, welding equipment, printed circuits, etc., can solve problems such as hindering the effective use of solder powder, and achieve excellent unique characteristics, enhanced reliability, and high miniaturization Effect

Inactive Publication Date: 2010-05-19
RESONAC HOLDINGS CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The fact that excessively attached solder powder is not easily recovered by drying process hinders effective utilization of solder powder

Method used

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  • Method for attachment of solder powder to electronic circuit board and soldered electronic circuit board
  • Method for attachment of solder powder to electronic circuit board and soldered electronic circuit board
  • Method for attachment of solder powder to electronic circuit board and soldered electronic circuit board

Examples

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Effect test

example 1

[0058] A printed wiring board with a minimum electrode pitch of 50 μm was produced. Copper is used for conductive circuits. As the thickener compound solution, a 2% by mass aqueous solution of an imidazole-based compound represented by the following general formula (1) adjusted to a pH of about 4 with acetic acid was used. The aqueous solution was heated to 40°C. In the heated aqueous solution, the printed wiring board pretreated with an aqueous solution of hydrochloric acid was dipped for 3 minutes to form a sticky substance on the surface of the copper circuit.

[0059]

[0060] Then, use figure 1 The apparatus shown in supplies the paste to the printed wiring board and at the same time exposes the printed wiring board to vibration of 50 Hz to make the solder powder adhere to the board, wherein the paste is dispersed in deoxygenated water at a concentration of 50% by volume Formed from 96.5Sn / 3.5Ag solder powder with an average particle size of about 20 μm. After the ...

example 2

[0063] A printed wiring board provided with an area array using an electrode diameter of 70 μm and an electrode pitch of 60 μm was fabricated. Copper is used for conductive circuits.

[0064] As the thickener compound solution, a 2% by mass aqueous solution of the same imidazole-based compound as used in Example 1, adjusted to a pH of about 4 with acetic acid, was used. The aqueous solution was heated to 40°C. In the heated aqueous solution, the printed wiring board pretreated with an aqueous hydrochloric acid solution was dipped for 3 minutes to form a sticky substance on the surface of the copper circuit.

[0065] Then, use figure 1 The apparatus shown in supplies the slurry to the printed wiring board, and at the same time exposes the printed wiring board to vibration of 50 Hz, wherein the slurry has an average particle diameter of about 60 μm by dispersing in deoxygenated water at a concentration of 50 volume % Formed of 96.5Sn / 3.5Ag solder powder. After the printed wi...

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Abstract

A method for the attachment of solder powder includes the steps of treating an exposed metallic surface of an electronic circuit board with a tackif ier compound, thereby imparting tackiness to the metallic surface to form a tacky part, and supplying the tacky part with a solder powder slurry suspended in a liquid, thereby inducing attachment of the solder powder. A method for the production of asoldered electronic circuit board, includes the steps of treating an exposed metallic surface of an electronic circuit board with a tackifier compound, thereby imparting tackiness to the metallic surface to form a tacky part, supplying the tacky part with a solder powder slurry suspended in a liquid, thereby inducing attachment of the solder powder, and thermally fusing the attached solder powder,thereby forming a circuit .

Description

[0001] Cross References to Related Applications [0002] This application is based upon an application filed under 35 U.S.C. §111(a) pursuant to 35 U.S.C. §119(e)(1), requiring a provisional application filed under 35 U.S.C. §111(b) on September 21, 2005 No. 60 / 718,737 and priority of Japanese Patent Application No. 2005-261835 filed September 9, 2005. technical field [0003] The present invention relates to a method for precisely attaching solder powder to only the exposed fine metal surface of an electronic circuit board (including a printed wiring board), for melting the solder powder and forming a solder layer on the exposed metal surface to A method of mounting electronic components on an electronic circuit board, and an electronic circuit board having a solder precoat formed thereon. Background technique [0004] In recent years, electronic circuit boards such as those having electronic circuit patterns formed on insulating substrates such as plastic substrates (poss...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/34B23K3/06H05K3/24
CPCB23K3/082B23K2101/42H05K3/3463H05K2203/0126H05K2203/0485
Inventor 庄司孝志堺丈和
Owner RESONAC HOLDINGS CORPORATION