Pneumatic device off-line checking system and method

Abstract

The invention provides a system and a method for off-line detecting a pneumatic device. The system comprises a control device which is used for generating a control signal, a signal transmission module which is connected with the control device and is used for transmitting the control signal, and an adjusting module of the pneumatic device, wherein, the adjusting module of the pneumatic device is used for receiving the control signal to adjust internal gas pressure of the pneumatic device and generating a feedback signal which is transmitted to the control device through the signal transmission module according to the change of the adjusted internal gas pressure, while the control device operates and processes the feedback signal to record the actuation condition result of the adjusting module of the pneumatic device so as to represent a failure analysis report. The system and the method for off-line detecting the pneumatic device can perform an off-line processing and a simulation analysis for projects which only can be detected under an online state in the prior art, detect the operating condition of the pneumatic device, and can offer the failure analysis report through providing various different test data, thereby improving yield and efficiency, effectively saving cost and achieving the aim of preventative maintenance.

Description

technical field [0001] The invention relates to a pneumatic device detection system and method, in particular to an off-line detection system and method for a pneumatic device of a chemical mechanical polishing machine. Background technique [0002] In the semiconductor process, chemical mechanical polishing (CMP) is a necessary step. In the chemical mechanical polishing process, a wafer carrier carries the wafer, and it is achieved by friction with the polishing pad under high-speed rotation. The purpose of flat surface. The mechanism used in the current wafer carrier carrying system includes many methods, among which the method of using vacuum to absorb and hold wafers has been widely used. The wafer carrier is also called a polishing head, which includes a polishing head main body, a fixed ring, a carrier film, an air pressure device, and a system for pushing down. [0003] However, the existing technology of using vacuum suction to carry the wafer, after actual operati...

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Problems solved by technology

[0003] However, the existing technology of using vacuum suction to carry the wafer, after actual operation, it is found that in the process of chemical mechanical polishing, the wafer often breaks away from the wafer carrier due to abnormal suction pressure, that is, "slip". , and due to the force of high-speed rotation, the wafer after the slide often collides with the machine and is damaged and cannot be used, resulting in defective products of fragments. This is a big loss in terms of cost for expensive wafers

[0004] In the semiconductor process, a series of processes are automated, so it is impossible to immediately stop the process to perform online detection in real time when an error occurs, because this has a serious impact on the overall progress of the process. The most important thing in the semiconductor process is Efficiency and Yield

Therefore, there is currently no system and method that can simulate, analyze and detect the working conditions of the pneumatic device in an offline state, so that it is impossible to completely control the working characteristics of the machine under the state we want

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