Thin film residual stress component analytical equipment
A residual stress and analysis device technology, applied in measuring devices, analysis materials, material thermal analysis, etc., can solve problems such as threats to firmness, and achieve the effects of improving the plating process, convenient operation, and rapid measurement
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[0016] like figure 1 , 2 As shown, the device for analyzing film stress includes a relay temperature controller 1, a heater drive circuit 2, a substrate fixture 3, an interferometer 4, and a computer 5. The relay temperature controller 1 is connected with the heater drive circuit 2 and the substrate fixture 3 in sequence. , an interferometer 4, and a computer 5 are connected, and the substrate fixture 3 includes a first copper sheet 6, a second copper sheet 7, an aluminum sheet 8, an iron clip 9, a sample fixing round hole 10, a thermal resistance 11, and an MCH heating sheet 12, The back of the first copper sheet 6 is fixed with a thermal resistor 11 and two MCH heating sheets 12, the two sides of the first copper sheet 6 are provided with fixed grooves, and the second copper sheet 7 is inserted into the fixed grooves provided on both sides of the first copper sheet 6. In the groove, two iron clips 9 are fixed on both sides of the second copper sheet 7 upper ends, and an alu...
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