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Thin film residual stress component analytical equipment

A residual stress and analysis device technology, applied in measuring devices, analysis materials, material thermal analysis, etc., can solve problems such as threats to firmness, and achieve the effects of improving the plating process, convenient operation, and rapid measurement

Inactive Publication Date: 2008-10-15
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But almost all films have huge stress, which poses a great threat to the performance of the film, especially the firmness

Method used

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  • Thin film residual stress component analytical equipment
  • Thin film residual stress component analytical equipment
  • Thin film residual stress component analytical equipment

Examples

Experimental program
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Effect test

Embodiment Construction

[0016] like figure 1 , 2 As shown, the device for analyzing film stress includes a relay temperature controller 1, a heater drive circuit 2, a substrate fixture 3, an interferometer 4, and a computer 5. The relay temperature controller 1 is connected with the heater drive circuit 2 and the substrate fixture 3 in sequence. , an interferometer 4, and a computer 5 are connected, and the substrate fixture 3 includes a first copper sheet 6, a second copper sheet 7, an aluminum sheet 8, an iron clip 9, a sample fixing round hole 10, a thermal resistance 11, and an MCH heating sheet 12, The back of the first copper sheet 6 is fixed with a thermal resistor 11 and two MCH heating sheets 12, the two sides of the first copper sheet 6 are provided with fixed grooves, and the second copper sheet 7 is inserted into the fixed grooves provided on both sides of the first copper sheet 6. In the groove, two iron clips 9 are fixed on both sides of the second copper sheet 7 upper ends, and an alu...

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PUM

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Abstract

The invention discloses a device for analyzing compositions of residual stress of a film. The invention comprises a relay temperature control instrument, a heating plate driving circuit, a substrate fixture, an interferometer and a computer, wherein, the relay temperature control instrument is connected with the heating plate driving circuit, the substrate fixture, the interferometer and the computer in turn; the substrate fixture comprises a first copper sheet, a second copper sheet, an aluminum sheet, iron clamping pieces, a sample fixation circular orifice, a thermal resistance and MCH heating plates; the thermal resistance and two MCH heating pieces are fixed on the back of the first copper sheet; fixed grooves are arranged on both sides of the first copper sheet; the second copper sheet is inserted into the fixed grooves which are arranged on both sides of the first copper sheet; two iron clamping pieces are fixed on both sides of the upper end of the second copper sheet; the aluminum sheet is clamped on the two iron clamping pieces; and the sample fixation circular orifice is arranged on the aluminum sheet. The invention is a non-destructive detection method and has the advantages of convenient operation, quick measurement, high precision, capability of simultaneously determining a plurality of parameters and performing stress component analysis and so on.

Description

technical field [0001] The invention relates to a device for analyzing residual stress components of thin films. Background technique [0002] Optical thin films are widely used. Beam splitters, cut-off filters and bandpass filters used in optical systems are realized by optical thin films; in addition, a large number of thin-film devices are also used in optical fiber communications and laser optics; thin-film It is also widely used in information storage, semiconductor devices, photoelectric display and other fields. But almost all films have huge stress, which poses a great threat to the performance of the film, especially the firmness. Therefore, it is of great significance to study the stress in the thin film. In terms of composition, the stress in the film is mainly composed of intrinsic stress (also called internal stress), external stress and thermal stress. Intrinsic stress is related to the chemical composition, microstructure and crystal phase of the film, and ...

Claims

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Application Information

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IPC IPC(8): G01N21/45G01N25/00G01N19/00
Inventor 章岳光陈为兰沈伟东王颖顾培夫黄文彪
Owner ZHEJIANG UNIV
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