Method of forming scribe line on substrate of brittle material and scribe line forming apparatus
A technology of brittle material substrates and predetermined lines, which is applied in the direction of fine working devices, glass cutting devices, polycrystalline material growth, etc., can solve the problems of unsmooth rotation of the shaft support part, accelerated wear of the shaft support part, shortening the life of the cutting knife, etc. , to achieve the effect of reducing various defects, ensuring stability and high section quality
Inactive Publication Date: 2008-10-29
MITSUBOSHI DIAMOND IND CO LTD
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Problems solved by technology
As a result, it is necessary to frequently scatter on the table of the scribing device or the breaking device (used after the scribing line is formed) to clean up the waste glass
[0003] In addition, the generated waste cullet will enter the rotating part used to support the rotation of the blade of the wheel cutter, so that the wear of the shaft support part is accelerated, or the rotation of the shaft support part is not smooth so that the wear of the blade edge is accelerated, and as a result Will shorten cutter life
Method used
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[0047]The detailed situation of the present invention is described below according to accompanying drawing. figure 1 It is a schematic configuration diagram of a scribe line forming device shown as one embodiment of the invention viewed from the front. In the structure of this device, the slide table 2 is set so that it can be moved along a pair of guide rails 3, 4 arranged in parallel on the horizontal platform 1. figure 1 The back and forth direction (hereinafter referred to as the Y direction) reciprocates. Between the two guide rails 3 and 4, a screw rod 5 is disposed in the front-rear direction, on which a stay 6 fixed to the slide table 2 is screwed, and the screw rod is driven by a motor (not shown). 5 forward and reverse, so that the slide table 2 moves back and forth along the guide rails 3 and 4 in the Y direction.
[0048] Configure the horizontal platform seat 7 on the slide table 2, so that along the guide rail 8 figure 1 The left and right directions (hereinaf...
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Abstract
A method of forming a scribe line, and apparatus therefor, realizing division of a substrate of brittle material with high straightness along a scribe line. The surface of brittle material substrate is heated at a temperature lower than the softening point of the brittle material substrate along a line destined for scribe line formation by the use of laser beams, and immediately after the heating, the heated region is cooled to thereby produce a first crack. Thereafter, along the scribe line, a cutter is traveled in pressurized contact on the substrate surface to thereby form a crack deeper than the first crack in the substrate.
Description
technical field [0001] The present invention relates to a method for forming a scribe line on a substrate when dividing a single piece and a bonded mother substrate composed of brittle materials such as glass, ceramics as sintered materials, single crystal silicon, semiconductor wafers, ceramic substrates, etc. scribe line) method and device thereof. Background technique [0002] In general, when dividing a brittle material substrate such as a glass substrate, a method is widely used in which a rotary knife such as a cutter wheel is rotated on the surface of the substrate to carve a scribe line on the substrate, and along the scribe line, The wires generate cracks in the thickness direction, thereby dividing the substrate. When forming a scribe line with a wheel cutter, it is necessary to press the wheel cutter against the surface of the brittle substrate with strong pressure and rotate it to make the scribe line, so various defects will occur. For example, when using a wh...
Claims
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IPC IPC(8): B28D5/00C03B33/02C03B33/027C03B33/09C30B29/06C30B33/00H01L21/301B28D1/24
CPCB28D5/0011H01L21/67092B28D1/221C03B33/091Y02P40/57C03B33/027C03B33/033C03B33/09H01L21/30
Inventor 曾山正信
Owner MITSUBOSHI DIAMOND IND CO LTD