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Image sensing module and production method thereof as well as image capturing device

An image capture device and image sensing technology, applied in radiation control devices, image communications, televisions, etc., can solve the problems of time-consuming assembly, high material cost, bulky lens group 130, etc., to reduce volume and production costs, Improved productivity and reduced assembly time

Active Publication Date: 2010-09-08
UNITED MICROELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In the prior art, due to the many components of the lens group 130, not only the material cost is high, but also the assembly is time-consuming, resulting in high production cost
In addition, the assembled lens group 130 is relatively bulky
Therefore, the conventional CMOS image sensing module 100 is not only costly, but also cannot be applied to small electronic products such as cell phones and pinhole cameras due to its bulky size.

Method used

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  • Image sensing module and production method thereof as well as image capturing device
  • Image sensing module and production method thereof as well as image capturing device
  • Image sensing module and production method thereof as well as image capturing device

Examples

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Embodiment Construction

[0082] FIG. 2 is a schematic diagram of an image sensing module according to an embodiment of the invention. Referring to FIG. 2 , the image sensing module 200 of this embodiment includes a substrate 210 , a plurality of image sensing units 220 , a plurality of microlenses 230 and a focusing unit 240 . Wherein, the image sensing unit 220 is disposed on the substrate 210 , and the microlenses 230 are respectively disposed on one of the image sensing units 220 . The focusing unit 240 is disposed on the substrate 210 and covers the microlens 230 . The top surface 242 of the focusing unit 240 is a curved surface.

[0083] In the above-mentioned image sensing module 200, the substrate 210 is, for example, a circuit board, and the upper surface of the substrate 210 has a sensing area 212 and a peripheral area 214 connected to the sensing area 212, wherein the image sensing unit 220 is configured within the sensing area 212 . The circuit layer 216 of the peripheral area 214 can ex...

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Abstract

The invention discloses an image sensing module, comprising a base plate, a plurality of image sensing units, a plurality of micro lens and a focusing unit, wherein, the image sensing units are arranged on the base plate, and the micro lens are respectively arranged on one of the image sensing units. The focusing unit is arranged on the base plate and coves the micro lens. The top surface of the focusing unit is a curved surface. In addition, the invention provides a manufacturing method of the image sensing module and an image retrieving device.

Description

technical field [0001] The present invention relates to an image sensing module, and in particular to an image sensing module with a focusing unit, a manufacturing method thereof, and an image capture device with the image sensing module. Background technique [0002] Complementary metal-oxide-semiconductor crystal image sensor (CMOS image sensor, CIS) is compatible with the manufacturing process of complementary metal-oxide-semiconductor crystal, and can be easily integrated with other peripheral circuits on the same chip, so it can greatly reduce the The cost and power consumption of the image sensor. Therefore, in recent years, CMOS image sensors have become a substitute for charge-coupled devices in low-cost applications, and the importance of CMOS image sensors is increasing day by day. . [0003] FIG. 1A is a schematic diagram of a conventional CMOS image sensor module, and FIG. 1B is an exploded view of FIG. 1A . Please refer to FIG. 1A and FIG. 1B , the convention...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04N5/335H04N5/225H01L27/146G02B3/00H04N25/00
Inventor 宣明智柯宗羲陈立哲
Owner UNITED MICROELECTRONICS CORP