Method for preparing electroconductive particles with improved dispersion and adherence

A dispersive and adsorbent technology, applied in liquid chemical plating, metal material coating process, coating, etc., can solve the problems of difficult removal of aggregation phenomenon, complicated process, high cost, etc., to reduce the operating cost of the program , the effect of simplifying the process

Inactive Publication Date: 2008-11-12
HANWHA CHEMICAL CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, its disadvantage is that the grinding process will destroy the metal film formed on the surface of the particles and thus reduce the conductivity. Even if the sorting process has been carried out, the aggregation caused by the manufacturing process is difficult to be completely removed, and the process control is costly. cost and complicated

Method used

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  • Method for preparing electroconductive particles with improved dispersion and adherence
  • Method for preparing electroconductive particles with improved dispersion and adherence
  • Method for preparing electroconductive particles with improved dispersion and adherence

Examples

Experimental program
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Embodiment

[0041] According to the present invention, the method for preparing conductive powder with excellent dispersibility and adsorption property will be described in detail in the following description.

[0042] However, the following examples do not limit the spirit of the present invention.

Embodiment 1

[0044] (Pre-treatment process of nickel plating)

[0045] The acryl based powder used had an average particle diameter of 3.6 μm, an aspect ratio of 1.06 and a vibration coefficient (Cv) of 5%. Disperse 5 g of powder in chromium oxide (CrO 3 ) and sulfuric acid in a mixed solution, followed by an ultrasonic cleaner for 30 minutes. After the above steps are completed, the powder is subjected to precipitation at a temperature of 60° C. for ten minutes, and then washed with deionized water. After cleaning, in tin dichloride (SnCl 2 ) in an aqueous solution (0.1 g / l) for three minutes. After precipitation, wash with cold deionized water. Next, in palladium dichloride (PdCl 2 ) aqueous solution (0.1 g / l) for three minutes, and then washed several times with cold deionized water, finally a slurry can be obtained.

[0046] (nickel plating process)

[0047] Phosphate (NaH 2 PO 2 ) aqueous solution as a dispersion liquid, the solution is heated to a temperature of 60° C., and ...

Embodiment 2

[0065] The pretreatment process carried out is the same as in Example 1, and the electroplating procedure is the same as in Example 1, except that 0.5g of polyethylene glycol (polyethyleneglycol) (molecular weight 20,000) is added in the electroplating procedure, which is a reduction Compounds with surface tension. The dispersibility, conductivity, density and adhesion of the prepared nickel electroplating powder are listed in Table 1 below. Photos of plating uniformity taken with a scanning electron microscope show the figure 2 .

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Abstract

The present invention relates to a method of producing electroconductive electroless plating powder having excellent dispersibility and adherence, and, more particularly, to a method of producing electroconductive electroless plating powder having excellent dispersibility and adherence, using an electroless plating method of forming a metal plating layer on the surface of a base material made of resin powder in an electroless plating solution, wherein an ultrasonic treatment is performed at the time of forming the plating layer. The present invention has advantages in that an aggregation phenomenon, which is generated when the base material made of the resin powder is plated using an electroless plating method, does not occur and a plating reaction can be performed at low temperature, so that it is possible to obtain a compact plating layer and plating powder having improved uniformity and adherence with respect to resin powder. Further, the present invention, unlike the conventional technique, has advantages in that post-treatment processes are not performed and a plating reaction is performed at low temperature, so that the process operating cost is reduced and the processes are made simple.

Description

technical field [0001] This application claims Korean Patent No. 10-2005-0097085, dated October 14, 2005, titled "A Method for Preparing Conductive Particles with Excellent Dispersibility and Adsorption", which includes The full text of the references. [0002] The present invention relates to a method for preparing conductive electroless plating powder with excellent dispersibility and adsorption, especially a method for preparing conductive electroless plating powder with excellent dispersibility and adsorption. The electroplating process includes the use of ultrasonic method, so it can prevent the occurrence of aggregation and reduce the temperature when the electroplating reaction can be carried out. As a result, the electroplating powder can not be damaged, the dispersion can be improved, and the electroplating layer can be evenly attached to the resin. powder, thus providing electrical conductivity. Background technique [0003] In general, resin particle materials t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/54
CPCC23C18/30C23C18/34C23C18/285C23C18/24C23C18/1666C23C18/1633
Inventor 孙元一金东钰陈正熙吴锡宪
Owner HANWHA CHEMICAL CORPORATION
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