Radiation system for calculation processing arrangements and equipment adopting the heat radiation system

A technology of cooling system and processing equipment, applied in computing, electrical digital data processing, digital data processing components and other directions, can solve the problems of reducing the comfort of the working environment, lack of installation flexibility, affecting work efficiency, etc., to achieve installation and replacement Convenience, easy centralized management, and the effect of improving heat dissipation efficiency

Inactive Publication Date: 2008-11-19
SUN YAT SEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the above heat dissipation methods have disadvantages: (1) The heat dissipation efficiency is low, resulting in high cooling costs including equipment investment and energy consumption; (2) The noise produced by forced air convection is large; (3) The local temperature difference in the working room is large
Both (2) and (3) will reduce

Method used

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  • Radiation system for calculation processing arrangements and equipment adopting the heat radiation system
  • Radiation system for calculation processing arrangements and equipment adopting the heat radiation system
  • Radiation system for calculation processing arrangements and equipment adopting the heat radiation system

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0041] Example 1

[0042] As shown in Figure 2, in this embodiment, the thermally conductive connector of the present invention is used in the computer 1, which includes a case 11, a heat source 12 inside the computer 1, and a thermally conductive connector 13 arranged on the case 11 and connected to the heat source 12. . The heat source 12 includes a CPU, a DSP, or an integrated chip of the CPU and DSP, but is not limited to the above heat source, and may also include other heating elements inside the computer 1. The heat transfer modes of the computer 1 and the cooling circuit 2 include plug-in solid / solid contact heat transfer, fluid / solid interface heat transfer and heat transfer, and so on.

[0043] Such as image 3 As shown, the thermally conductive connector 13 of the first embodiment of the thermally conductive connector of the present invention includes a connector housing 131 installed on the computer 1, a heat pipe 132 provided in the connector housing 131 and connected...

Example Embodiment

[0045] Example 2

[0046] Such as Figure 4 As shown, the other parts of this embodiment are the same as that of Embodiment 1, except that:

[0047] The outer surfaces of the first heat conductor 1311 and the second heat conductor 1312 are also provided with serrated heat conducting ribs 1310, while the serrated heat conducting ribs 1310 in this embodiment are perpendicular to the extending direction of the heat pipe 132 (that is, it is opposite to the extending direction of the pipe 133). Vertical), it can also achieve the effect of increasing the heat exchange area and enhancing the heat dissipation effect.

Example Embodiment

[0048] Example 3

[0049] Such as Figure 5 The thermally conductive connector 13 shown is a single-enclosed solid / fluid thermally conductive type. The thermally conductive connector 13 includes a connector housing 131 installed on the chassis 11 of the computer 1, and a heat pipe 132 arranged in the connector housing 131 and connected to the heat source 12. The connector housing 131 is a single-layer structure with a fluid inlet 1313 and a fluid outlet 1314 on both sides. The cooling medium enters the connector housing 131 from the fluid inlet 1313, exchanges heat with the heat pipe 132, and then absorbs heat for cooling The medium exits the connector housing 131 through the fluid outlet 1314. That is, heat exchange is performed between the solid heat pipe 132 and the fluid cooling medium, and the heat pipe 132 is cooled. Spiral fins or external threads 1321 are provided inside the connector housing 131 and around the heat pipe 132. The fins or external threads 1321 can be welded...

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PUM

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Abstract

The invention discloses a cooling system for a computing processing device or a computing processing unit and comprises a heat pipe which educes the heat of a heating component of the cooling system, and a cooling loop outside the heat pipe; the cooling system further comprises a thermal conductive connector which comprises a cooling media channel; the cooling loop outside the heat pipe and the cooling media channel of the thermal conductive connector form a circulation loop of the cooling medium; the heat pipe has a condensation end which is arranged inside the thermal conductive connector and created heat transfer with the cooling medium in the cooling medium channel. The cooling system of the invention has simple assembly, high thermal efficiency and low noise, and can effectively reduce the local temperature difference in a computer room.

Description

technical field [0001] The present invention relates to a cooling system for computing processing equipment or computing processing units and equipment using the cooling system, especially computing processing equipment and computing processing systems. Background technique [0002] With the increasing integration of computer chips, the heat dissipation of computers has become an important factor affecting computer performance. The CPU on the main board and the DSP on the graphics card are the main heat sources inside the computer. Strengthening the cooling of them is an important topic of computer research, especially for workstations, servers and other areas where computers are dense and have a large heat dissipation, the demand for heat dissipation is even greater. high. At present, the main heat dissipation method of computer is to dissipate heat through forced convection or first utilize heat conductor or heat pipe to transfer heat to the chassis, and then discharge he...

Claims

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Application Information

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IPC IPC(8): G06F1/20
Inventor 何振辉祁新梅孙西辉黄臻成张展
Owner SUN YAT SEN UNIV
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