Austenite stainless steel plate for pressboard

A stainless steel plate and austenitic system technology, applied in the field of austenitic stainless steel, can solve the problems of hardness, inability to manufacture pressing plates, and copper foil breakage.

Inactive Publication Date: 2008-12-03
NISSHIN STEEL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] 2. hard
Therefore, the press plate manufactured using the existing material has a problem that, in thermocompression forming, the copper foil is subjected to shrinkage stress due to the difference in thermal expansion from the press plate, and cracks or wrinkles occur
[0018] However, if the proportion of hard martensite in austenitic stainless steel is reduced and the proportion of soft austenite is increased, it is impossible to manufacture a press plate that satisfies hardness (another important characteristic)
Regarding this point, as a method of making stainless steel have the hardness level required for the press plate, there is no practical method that replaces the formation of martensite.

Method used

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  • Austenite stainless steel plate for pressboard

Examples

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Embodiment

[0075] The following examples are given to describe the present invention in detail, but the present invention is not limited to the following examples.

[0076] i) Manufacture of pressing plate

[0077] 1. Manufacture of steel plate

[0078] 80 t of test materials each having the compositions shown in A to D of Table 1 were vacuum-melted in an electric furnace, and steel ingots having a thickness of 200 mm were cast. The obtained steel ingot was subjected to hot rolling to manufacture a hot-rolled sheet having a thickness of 3.0 mm. These hot-rolled sheets were annealed, pickled, and then cold-rolled to produce cold-rolled sheets with a thickness of 1.5 mm or 1.0 mm. These cold-rolled sheets were annealed, pickled, and then cold-rolled to obtain 0.6-mm-thick steel sheets Nos. 1 to 8 made of austenitic stainless steel in Examples or Comparative Examples.

[0079] 2. Aging treatment

[0080] Cut the steel plates No.1 to 8 into 500mm×500mm, sandwich them between two 600mm×60...

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Abstract

The invention relates to an austenitic stainless steel plate for pressure plate. The invention provides a new pressure plate material; the material is able to easily produce the pressure plate which has both planeness and hardness that are difficult to exist at the same time and has coefficient of heat expansion in the same degree with the coefficient of heat expansion of the copper. The invention provides an austenitic stainless steel plate for pressure plate, comprising 1.0 mass% to 4.0 mass% Si, 10.0 mass% to 25.0 mass% Cr, 5.0 mass% to 15.0 mass% Ni, less than 0.3 mass% (containing 0 mass%) C+N, less than 5 mass% (containing 0 mass%) Mn, less than 5 mass% (containing 0 mass%) Cu, less than 5 mass% (containing 0 mass%) Mo and the excess being Fe and unavoidable impurity; and the austenitic stability index Md30 (degree centigrade) of the stainless steel plate expressed by the following formula is less than 25. Md30 (degree centigrade)=551-462(C+N)-9.2Si-8.1Mn-29(Ni+Cu)-13.7Cr-18.5Mo...(1).

Description

technical field [0001] The present invention relates to austenitic stainless steel for press plates, that is, austenitic stainless steel used as a material in the manufacture of press plates. [0002] Furthermore, this invention relates to the manufacturing method of the press plate using this austenitic stainless steel, and the press plate formed from this austenitic stainless steel. Background technique [0003] Press plate refers to the thickness used to separate the press from the multilayer laminate or from each other when manufacturing multilayer laminates such as multilayer printed circuit boards, decorative boards, and plywood by press molding It is a flat jig with a thickness of several millimeters or less. [0004] For example, in the case of manufacturing a multilayer printed circuit board, a copper-clad laminate (circuit forming board) and an adhesive prepreg (sheet-like resin) are stacked, and copper foil is laminated on the upper and lower parts to produce To...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C38/58C22C38/44B21B1/22C21D9/52
CPCC21D2211/001C22C38/001C22C38/02C22C38/04C22C38/34C22C38/42C22C38/44C22C38/58C22C2202/00H05K3/46
Inventor 铃木聪藤本广弘中明
Owner NISSHIN STEEL CO LTD
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