F level heating solvent-free solvent-impregnated resin suitable for subatmospheric pressure

A technology of resin impregnation and vacuum pressure, applied in the direction of plastic/resin/wax insulators, organic insulators, etc., can solve the problems of poor thermal mechanical strength, easy deformation, poisonous impregnated resin, etc., to achieve small quality loss, fast curing at high temperature, The effect of improving electrical performance

Active Publication Date: 2008-12-10
上海同立电工材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] One of the technical problems to be solved by the present invention is to provide a kind of impregnating resin that does not contain active diluents such as styrene in view of the shortcomings of existing impregnating resins containing reactive diluents such as styrene, which are toxic, poor in thermal mechanical strength, and easy to deform. Impregnated resin to improve its thermal mechanical strength and non-toxic and harmless

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] A solvent-free impregnating resin suitable for vacuum pressure class F heating, each component includes the following components in parts by weight:

[0039] 100 parts epoxy resin

[0040] 2 parts methyl hydroquinone

[0041] 80 parts of methyl hexahydrophthalic anhydride

[0042] 10 parts dibutyl phthalate

[0043] Wherein, the epoxy resin is a bisphenol A type epoxy resin, and the bisphenol A type epoxy resin and methyl hydroquinone are mixed to form component A, and methyl hexahydrophthalic anhydride and dibutyl phthalate To mix into Part B, mix in a ratio of 100 parts A to 80-120 parts B. Component B wherein can be one of 80 parts, 85 parts, 90 parts, 95 parts, 100 parts, 105 parts, 110 parts, 115 parts and 120 parts.

[0044] A method for preparing a solvent-free impregnating resin suitable for vacuum pressure class F heating, carried out in steps:

[0045] 1) Add methyl hydroquinone as a stabilizer to bisphenol A epoxy resin, heat to 35°C-70°C and stir until ...

Embodiment 2

[0055] In the present embodiment, the stabilizing agent selects trimethylhydroquinone, the acid anhydride selects methyl nadic acid anhydride, and the plasticizer selects butyl benzyl phthalate for use, and each component includes the following components in parts by weight:

[0056] Bisphenol A type epoxy resin 100 parts

[0057] Trimethylhydroquinone 2.2 parts

[0058] Methyl nadic anhydride 85 parts

[0059] Butyl benzyl phthalate 12 parts

[0060] Others are the same as in Example 1.

Embodiment 3

[0062] In the present embodiment, the stabilizing agent is selected hydroquinone, the acid anhydride is selected methyl nadic anhydride, and the plasticizer is selected dioctyl terephthalate, and each component includes the following components in parts by weight:

[0063] Bisphenol A type epoxy resin 100 parts

[0064] Hydroquinone 2.5 parts

[0065] Methyl nadic anhydride 90 parts

[0066] Dioctyl terephthalate 15 parts

[0067] Others are the same as in Example 1.

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Abstract

The invention discloses a vacuum pressure F-grade heating solvent-free solvent impregnated resin, comprising the following compositions by weight portion: 100 portions of an epoxide resin, 2 to 4 portions of a stabilizing agent, 80 to 120 portions of fluid estolide and 10 to 20 portions of a plasticizer, wherein, the epoxide resin is a bisphenol A-type expoxide resin, the epoxide resin and the stabilizing agent are mixed into a composition A, the fluid estolide and the plasticizer are mixed into a composition B, and 100 portions of the composition A and 80 to 120 portions of the composition B are mixed. The composition A and the composition B are respectively packaged and stored and are used after mixed according to the ratio of 1 to 0.8-1.2. The solvent impregnated resin is used together with special dry mica tape and special moderate-resin mica tape which contain a curing accelerating agent and are matched with the solvent impregnated resin specially. The vacuum pressure F-grade heating solvent-free solvent impregnated resin has the advantages of innocuousness, innocuity, good thermal state mechanical intensity and low possibility of deformation.

Description

technical field [0001] The invention relates to an impregnating resin, in particular to a vacuum pressure impregnating resin without styrene active diluent, which is suitable for VPI of F-class high-voltage motors, complete impregnation of stator windings of electrical appliances, and complete impregnation and coil VPI of generators. At the same time, it also relates to the preparation, use method and application of the impregnating resin. Background technique [0002] In the manufacturing technology of high-voltage motors and power generation equipment, the performance of insulating materials and the stability of long-term use are one of the core technologies of products. Improving the temperature resistance level of products, improving the thermal mechanical properties of insulation structures, reducing the "three wastes" emissions in the production process, reducing energy consumption, and improving production efficiency have gradually become the focus of domestic electro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/02C08K5/00C08K5/09H01B3/40
Inventor 倪永庆李雪
Owner 上海同立电工材料有限公司
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