Semiconductor device and manufacturing method thereof

Abstract

The invention relates to a semiconductor device mixed with magnetic powder and a manufacturing method thereof. According to the invention, because a material mixed with the magnetic powder in the resin forms a sealing membrane, interfering electromagnetic radiation noise can be restrained from an integrated circuit on the upper surface of a semiconductor substrate to the exterior or inversely from the exterior to an integrated circuit on the upper surface of a semiconductor substrate. In addition, in a semiconductor device comprising a spiral membrane inductive component named as CSP, a magnetic membrane formed by a material mixed with the magnetic powder in the resin is arranged between the semiconductor substrate and the membrane inductive component, thereby reducing eddy current loss of the membrane inductive component caused by eddy current generated in the semiconductor substrate.

Description

technical field [0001] The present invention relates to a semiconductor device mixed with magnetic substance powder and its manufacturing method. Background technique [0002] In Japanese Unexamined Patent Application Publication No. 2004-342876 (FIG. 6), a semiconductor device called CSP (chip size package) is disclosed, in which a plurality of wirings are provided on a semiconductor substrate, and a connection pad of the wirings is A columnar electrode is provided on the upper surface of the part, and a sealing film formed of epoxy resin or the like is provided on a semiconductor substrate including wiring so that its upper surface is on the same surface as the upper surface of the columnar electrode, and on the upper surface of the columnar electrode Solder balls are provided on it. [0003] However, in Japanese Unexamined Patent Publication No. 2004-342876 (FIG. 6), the upper surface side of the semiconductor substrate can be protected from contamination and damage from...

AI Technical Summary

Problems solved by technology

[0003] However, in Japanese Unexamined Patent Publication No. 2004-342876 (FIG. 6), the upper surface side of the semiconductor substrate can be protected from contamination and damage from the external atmosphere by a sealing film formed of epoxy resin or the like, but there are The problem is that disturbing electromagnetic radiation noise from the upper surface side of the semiconductor substrate to the outside, or vice versa from the outside to the upper surface side of the semiconductor substrate cannot be suppressed.

[0005] However, in Japanese Patent No. 3540729, since the spiral-shaped thin-film inductor element is provided on the upper surface of the protective film, there is a problem that, under the action of the eddy current generated in the semiconductor substrate, the thin-film inductor element Eddy current loss, which degrades the characteristics of thin film inductors (Q value decreases)

Images