Numerical control selected area electrochemical deposition rapid forming method and apparatus
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- ZHEJIANG SCI-TECH UNIV
- Publication Date
- 2008-12-24
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention relates to an electroforming technology and a rapid prototyping technology, in particular to a method and a device for a rapid prototyping method and device of numerically controlled selective-area electrochemical deposition. Background technique
[0002] Rapid prototyping technology (Rapid Prototyping, RP) is a new type of manufacturing technology produced and developed in the early 1980s. It combines computer, CAD / CAM, numerical control, laser, new materials, precision servo, physics and chemistry, etc. It is a high-tech that integrates modern advanced scientific and technological achievements in the field of engineering. This technology adopts the material accumulation method to directly mold the CAD data under the control of the computer to form complex parts at one time. According to the 3D design model of the product, the outline of the section of each layer is obtained by layering and slicing, and the production problem of the 3D p...