Photovoltaic modules and interconnect methodology for fabricating the same

Abstract

A solar cell array includes a series of photovoltaic cells having a front side and a back side. Each photovoltaic cell also includes front contacts and back contacts disposed on the front side and back side of each cell respectively, wherein the front contacts and the back contacts are accessible from the back side of each cell. The solar cell array also includes multiple tabs electrically coupled to the front contacts and configured to provide electrical paths from the front contacts to the back side of each photovoltaic cell. Further, the photovoltaic cells are interconnected by multiple interconnect leads that are coupled from a tab on the back side of a first photovoltaic cell to a back contact point on the back side of a second photovoltaic cell. An automated method of interconnecting the photovoltaic cells in the solar cell array is also disclosed.

Description

technical field [0001] The present invention relates generally to solar cells, and more particularly, but not exclusively, to structural members for interconnecting solar cells. Background technique [0002] A solar cell, also known as a photovoltaic cell, is a well-known device that converts solar radiation into electrical energy. Solar cells can be fabricated on semiconductor wafers using semiconductor processing techniques. Typically solar cells include one or more photoactive materials sandwiched between two electrodes. Conventional solar cells include n-type doped regions and p-type doped regions fabricated on a silicon substrate. The solar radiation impinging on the solar cell generates electrons and holes which migrate to the p-type doped region and the n-type doped region respectively, thereby creating a voltage difference between the doped regions. [0003] A single solar cell typically produces only a small amount of power, which is usually much less than most a...

AI Technical Summary

Problems solved by technology

But problems with such PV stacks include limited packing density, resistive losses, and lack of assembly automation (which can lead to damage and contamination)

Strings built during assembly are fragile, difficult to handle, and require manual handling for repair or secondary processing

As a result, standard manufacturing techniques lack automation for microelectronic electronic card assembly and test construction, and yields are relatively low, cells cannot be positioned accurately and manual secondary processing operations are difficult

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