Apparatus for micro heat pipe vacuum pumping liquid injection

Abstract

The invention provides a device for the vacuum-pumping injection of a micro-thermal tube, which is formed by a vacuum-pumping portion, a micro-liquid calibration portion and an injection portion, wherein the vacuum-pumping portion is formed by a vacuum pump and a capillary flexible pipe, one end of the capillary flexible pipe is connected with the vacuum pump, and the other end is sealed with the injection hole of the micro-thermal tube through an injection needle, the micro-liquid calibration portion is formed by a capillary flexible pipe and a mini-size pliers which is used to clamp the flexible pipe to block liquid or gas in the pipe, and the injection amount is calibrated through the length of the capillary flexible pipe, and the injection portion is formed by a capillary flexible pipe, an injection needle and a syringe, wherein liquid is injected into the capillary flexible pipe through the syringe and the injection needle, the injection needle is penetrated into the capillary flexible pipe through the injection hole, and the three portion commonly share the same capillary flexible pipe and the same injection hole, and therefore the three portions are combined by the capillary flexible pipe to connect with a to-be-injected micro-thermal tube. The device of the invention has the advantages of simple structure, smart design, and high injection amount control precision, high vacuum-pumping precision and convenient and reliable operation.

Description

[0001] (1) Field [0002] The invention relates to a vacuum pumping and liquid injection technology, in particular to a device for vacuuming a micro heat pipe and injecting liquid in a precise micro amount. (2) Background technology [0003] Heat pipe technology was produced in the 1960s and was first used in the US military. After 1964, heat pipe technology was gradually widely used. With the development of electronic technology, integrated circuits are developing in the direction of high density and high power, which increases the heat flux density of chips and reduces the heat dissipation space. The heat dissipation problem seriously restricts the development of the electronic information industry. Since 1990, foreign countries began to develop micro-heat pipes, and put them into use around 1995. A single micro-heat pipe (outer diameter 3mm, length 100mm, 150mm series) has been applied to the cooling of the CPU chip of a laptop with a heat sink, but the heat transfer The c...

AI Technical Summary

Problems solved by technology

The current vacuum injection method is generally to open a vacuum hole and a liquid injection hole on the micro heat pipe in two steps, which makes it difficult to guarantee the accuracy of the liquid injection volume and the vacuum degree. In addition, it is necessary to seal the hole twice. Increased chance of process error

The common problems of such vacuum injection method are complex process, low precision and high cost.

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