Method for manufacturing micromechanical components

A micro-mechanical component and micro-mechanical technology, applied in the manufacture of micro-structure devices, electrical components, micro-structure technology, etc., can solve problems such as limiting the thickness of structural layers
CN101351400BInactive Publication Date: 2013-04-24VALTION TEKNILLINEN TUTKIMUSKESKUS
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
VALTION TEKNILLINEN TUTKIMUSKESKUS
Publication Date
2013-04-24
Estimated Expiration
Not applicable · inactive patent

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Abstract

The present invention relates to a method for manufacturing an acceleration sensor. In the method, thin SOI-wafer structures are used, in which grooves are etched, the walls of which are oxidized. A thick layer of electrode material, covering all other material, is grown on top of the structures, after which the surface is ground and polished chemo-mechanically, thin release holes are etched in the structure, structural patterns are formed, and finally etching using a hydrofluoric acid solution is performed to release the structures intended to move and to open a capacitive gap.
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Description

technical field

[0001] The present application relates to a method for obtaining narrow gaps in micromechanical components, in particular in micromechanical SOI-wafer structures, according to the preamble of claim 1 .

[0002] The present invention also relates to the silicon micromechanical structure according to any one of claims 8-9, and the application of the silicon micromechanical structure according to any one of claims 20-21. Background technique

[0003] According to prior art methods, silicon-micromechanical devices, such as acceleration sensors and other similar devices, are mainly manufactured by using SOI (silicon-on-insulator) wafer structures, on which grooves are etched, and the walls of the grooves are oxidized , and then the surface of the groove was made flat by fluorine-plasma etching.

[0004] [W.-T.Hsu, J.R.Clark, and C.T.-C Nguyen, 'A sub-micron capacitivegap process for multiple-metal-electrode lateral micromechanical resonators by Hsu et al. Micron...

Claims

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