White light LED for improving facula and encapsulation method thereof

A packaging method and white light technology, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems that white light LEDs cannot meet the market demand of high-end applications, poor output beam quality, and uneven light spots, etc., to improve the color zone achievement rate, Improve the shipment rate and solve the effect of uneven spot

Active Publication Date: 2009-01-28
LEDMAN OPTOELECTRONICS
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AI Technical Summary

Problems solved by technology

Due to the poor quality of the output beam, the light spot is uneven and the aperture is generated, which will make the hum

Method used

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  • White light LED for improving facula and encapsulation method thereof
  • White light LED for improving facula and encapsulation method thereof

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0029] see figure 1 , a white light LED with improved light spot, the LED blue light chip 2 is fixed in the concave metal receiving seat 1, the positive and negative electrodes of the LED blue light chip are respectively connected with the positive and negative pins in the concave metal receiving seat through the wire 3, A fluorescent glue layer 4 is arranged on the LED blue light chip, and a whitening glue layer 5 is arranged outside the fluorescent glue layer, and the concave metal socket 1, the LED blue light chip 2, the fluorescent glue layer 4 and the whitening glue layer 5 are packaged by epoxy resin 6 Among them; the fluorescent adhesive layer is composed of phosphor powder and epoxy resin; the whitening adhesive layer is composed of white particles and epoxy resin.

[0030] The fluorescent glue layer can also be composed of fluorescent powder and silica gel, or composed of fluorescent powder and silicone resin.

[0031] The whitening glue layer can also be composed of...

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PUM

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Abstract

The invention discloses a white light LED for improving light spots and an encapsulation method thereof. In the white light LED for improving the light spots, a luminous wafer is fixed in a metal stacker; conducting wires are respectively arranged between the luminous wafer and a positive metal stacker and between the luminous wafer and a negative metal stacker; the luminous wafer is provided with a fluorescent adhesive layer; the outside of the fluorescent adhesive layer is provided with a whitening adhesive layer; and the metal stacker, the luminescent wafer, the fluorescent adhesive layer and the whitening adhesive layer are encapsulated in the white light LED by epoxide resin. In the white light LED for improving the light spots, a layer of whitening adhesive is coated on the surface of fluorescent adhesive, so that yellow hue and blue core in light beam emitted by the prior white light LED are effectively improved, and the problem of uneven light spots is solved.

Description

technical field [0001] The invention relates to the field of LED lighting devices, in particular to a white light LED with improved light spots and a packaging method thereof. Background technique [0002] As a new type of light source, LED (Light Emitting Diode) is widely used in buildings, solar street lights, flashlights, car lights, desk lamps, backlights, and shooting lights because of its advantages such as low energy consumption, no pollution, small size, and convenient and flexible use. Lamps, courtyards, wall lamps, small-area decorative lighting for homes, and commercial lighting that integrates decoration and advertising, but the issue of white LED apertures has always been a concern for users. [0003] There are basically two types of existing white LEDs. One is a multi-chip type and the other is a single-chip type. The former is to package red, green, and blue LED chips together and make them emit light at the same time to generate white light. The latter uses...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01L33/50H01L33/52
Inventor 李漫铁邓小伟
Owner LEDMAN OPTOELECTRONICS
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