The present application provides a high-precision positioning method for LED
chip array arrangement. The method includes the following steps that: a
mask layout is designed according to
chip size, a
chip spacing, a
cutting line position and knife width, and a
mask plate is manufactured, wherein the
mask layout contains a plurality of arrayed chip patterns; a flexible film is fixed onto one side ofthe mask plate, wherein the one side of the mask plate is provided with the mask
layout, the flexible film is a transparent thin film resistant to temperatures greater than 150 DEG C, and a surface of the flexible film, which is far away from the mask plate, is an
adhesive surface, the
adhesive surface is used for fixing the chips; and a chip arrangement device with an
image identification function is utilized to fix the chips on the
adhesive surface, and the chip patterns on the mask plate are overlapped with the patterns of the arranged chips. With the method adopted, the accuracy of the arrangement spacing of the chips can be improved, the uniformity of the thickness of the encapsulant of the CSP (
Chip Scale
Package) chips and the uniformity of the
color temperature of the CSP chips can be improved, and the yield of LED chip
package can be improved.