The invention provides an
LED packaging method suitable for the LED field. The
LED packaging method includes the following steps that a
silicon chip is provided with
metal sheets in a vapor deposition mode, wherein the distance between each pair of
metal sheets equals the distance between the positive
electrode of each flip-
chip wafer and the negative
electrode of the flip-
chip wafer, and the width of each
metal sheet is larger than that of the positive
electrode and that of the negative electrode; the flip-chip wafers are fixed to the metal sheets to make the positive electrodes and the negative electrodes in one-to-one correspondence to the metal sheets; the
silicon chip is coated with fluorescent adhesives; the fluorescent adhesives between adjacent flip-chip wafers are removed; transparent packaging adhesives are applied, and an array-type LED film is obtained; the array-type LED film is taken down and
cut into a plurality of
LED packaging single bodies. According to the LED packaging method, because the flip-chip wafers are packaged on the
silicon chip and a packaging body is only composed of the flip-chip wafers, the fluorescent adhesives, the transparent packaging adhesives and the metal sheets, reliability is high, materials are saved, and cost is low. Limitations on shapes of supports do not exist, and therefore large-scale integrated packaging is facilitated; loss caused by scattering-in of photons in fluorescent
powder is reduced, and therefore product brightness can be conveniently improved; because it is not needed that the bottoms of the wafers are coated with Au-Sn
alloy layers, cost is reduced.