LED packaging method

Abstract

The invention provides an LED packaging method suitable for the LED field. The LED packaging method includes the following steps that a silicon chip is provided with metal sheets in a vapor deposition mode, wherein the distance between each pair of metal sheets equals the distance between the positive electrode of each flip-chip wafer and the negative electrode of the flip-chip wafer, and the width of each metal sheet is larger than that of the positive electrode and that of the negative electrode; the flip-chip wafers are fixed to the metal sheets to make the positive electrodes and the negative electrodes in one-to-one correspondence to the metal sheets; the silicon chip is coated with fluorescent adhesives; the fluorescent adhesives between adjacent flip-chip wafers are removed; transparent packaging adhesives are applied, and an array-type LED film is obtained; the array-type LED film is taken down and cut into a plurality of LED packaging single bodies. According to the LED packaging method, because the flip-chip wafers are packaged on the silicon chip and a packaging body is only composed of the flip-chip wafers, the fluorescent adhesives, the transparent packaging adhesives and the metal sheets, reliability is high, materials are saved, and cost is low. Limitations on shapes of supports do not exist, and therefore large-scale integrated packaging is facilitated; loss caused by scattering-in of photons in fluorescent powder is reduced, and therefore product brightness can be conveniently improved; because it is not needed that the bottoms of the wafers are coated with Au-Sn alloy layers, cost is reduced.

Description

technical field [0001] The invention relates to the technical field of LED product manufacturing, in particular to an LED packaging method. Background technique [0002] The packaging method of traditional white LED products is to fix the LED chip in the cup on the bracket by bonding or eutectic welding, and use gold wires to connect the positive pole of the chip to the positive pole of the bracket, and connect the negative pole of the chip to the On the negative pole of the bracket, fill the bowl with fluorescent glue that matches the target color area. Due to the different thermal expansion coefficients of brackets, fluorescent glue, and colloids used to bond chips, it is easy to have reliability problems in brackets, fluorescent glue, gold wires, colloids, etc.; and there are many types of LED brackets, bonding wafers and brackets. Most of the LED materials are PPA, PCT and EMC materials, and their high temperature resistance and air tightness have relatively large defec...

AI Technical Summary

Problems solved by technology

Due to the different thermal expansion coefficients of brackets, fluorescent glue, and colloids used to bond chips, it is easy to have reliability problems in brackets, fluorescent glue, gold wires, colloids, etc.; and there are many types of LED brackets, bonding wafers and brackets. Most of the materials are PPA, PCT and EMC materials, and their high temperature resistance and air tightness have relatively large defects, which will affect the reliability of LED products.

Although the ceramic bracket has good high temperature resistance and good air tightness, the cost of the bracket is close to the cost of the chip, and the manufacturing cost of the ceramic bracket package LED is expensive, and the investment in equipment is large, resulting in the small production capacity and high price of the LED product of the ceramic bracket.

Therefore, the defects of LED products with bracket package structure in terms of reliability, service life, manufacturing cost and price are the biggest obstacles for LED products to replace traditional lighting products.

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