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FPC substrate polyimide film special for LED and preparation method thereof

A technology of polyimide film and polyamic acid, which is applied in the field of polymer material manufacturing, can solve problems such as production and use restrictions, uncontrollable content, low thermal expansion coefficient, etc., and achieve good dimensional stability, strong economical practicability, Effect of low thermal expansion coefficient

Active Publication Date: 2019-11-12
无锡高拓新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It uses o-toluidine, 4,4'-diaminodiphenyl ether (ODA), p-phenylenediamine (PDA) dissolved in a polar solvent, and then added pyromellitic dianhydride (PMDA) to obtain polyamide Acid solution, the film is prepared by thermal imidization, although the cost of raw materials is controllable, but due to the use of polyamic acid random copolymerization technology, the rigid segment o-To / PMDA / o-To, o-To / PMDA / PDA And the content of PDA / PMDA / PDA is uncontrollable, which should lead to low elongation at break of the film
At the same time, due to the carcinogenicity of o-toluidine, its production and use are restricted, and it is not suitable for use on LEDs
Patent CN101407590A discloses a method for preparing a thermosetting polyimide hybrid film with high modulus and low thermal expansion coefficient. Rigid polyamic acid is first prepared, and then tetraethyl orthosilicate is added to the solution, and the sol-gel PI / SiO 2 hybrid films, with SiO 2 As the content increases, the thermal expansion coefficient of the film will gradually decrease, but at the same time it will also reduce the elongation at break and transparency of the film, and the water absorption rate of the film will increase, which cannot meet the requirements of LEDs.

Method used

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  • FPC substrate polyimide film special for LED and preparation method thereof
  • FPC substrate polyimide film special for LED and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Add a measured amount of N,N-dimethylacetamide solvent into an anhydrous stainless steel polymerization kettle, add 0.9mol ODA under stirring and fully dissolve, then add PMDA (1mol) equivalent to the total mole of diamine, stir rapidly for 10 minutes and then add 1,5'-naphthalene diamine (NDA) (0.1 mol) with the molar amount of the remaining diamine was reacted at 40° C. for 5 hours under normal pressure to obtain a uniform and transparent polyamic acid solution with a solid content of 20 wt%.

Embodiment 2～ Embodiment 5

[0034] The preparation method of the polyamic acid solution is the same as step 1. The specific parameters of the amount of each substance are shown in Table 1, and the solid content of the obtained polyamic acid solution is also 20 wt%.

[0035] Wherein, the molecular weight of the polyamic acid solution prepared in Examples 1 to 5 is about 250,000±10,000 mP·s at 20°C.

Embodiment 6

[0043] Embodiment 6: the preparation of polyimide film

[0044] The polyamic acid solutions prepared in Examples 1 to 5 and Comparative Examples 1 to 3 were subjected to vacuum degassing and ultrafine filtration, and were metered by a gear pump to form films on ring-shaped stainless steel belts by extrusion and salivation. After being peeled off from the steel strip by hot air drying, a uniform PI film with a film thickness of 25±1.0 μm was obtained after the imidization was completed by programming the temperature in a hot air oven under biaxial stretching. Measured according to the test method, its performance data are shown in Table 2.

[0045] Table 2 Properties of the film

[0046]

[0047] The test results (Table 2) show that, as can be seen from Example 1, when the amount of NDA is 10%, compared with Comparative Example 1, the properties of the film are basically similar. It can be seen from Example 5 that when the amount of NDA reaches 35%, the elongation at break...

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Abstract

The invention belongs to the field of manufacture of high polymer materials, and discloses an FPC substrate polyimide film special for LED and a preparation method thereof. The preparation method comprises the following steps: dissolving 4,4'-diaminodiphenyl ether in a strongly polar aprotic organic solvent, and additionally dissolving pyromellitic dianhydride therein by stirring; (2) adding 1,5'-diaminonaphthalene to the solution from the step (1) for polymerization to obtain a polyamide acid solution; and (3) preparing the FPC substrate polyimide film special for LED by thermal imidization of the polyamide acid solution from the step (2). The PI film provided in the invention has the functional characteristics of high elasticity modulus, small thermal expansion coefficient and low thermal shrinkage, thus exhibiting good dimensional stability and high economic practicality, and can be extensively used as a good substrate for a flexible circuit board in the LED field.

Description

technical field [0001] The invention relates to a special-purpose FPC base polyimide film for LEDs and a preparation method thereof, belonging to the field of polymer material manufacturing. Background technique [0002] In recent years, with the rapid development of my country's LED field, it is proposed that the polyimide film as the base material of its flexible circuit board (FPC) needs to be further improved under the condition that it fully meets the requirements for the preparation and use of LED products. Lower the selling price to strengthen the market competitiveness of LED products. At present, through the tracking and research of similar foreign technologies, domestic polyimide film manufacturers have been able to provide films that can basically meet the requirements for LED preparation, but in order to ensure their functional properties, they all use biphenyl, which is an expensive raw material. The market price of tetracarboxylic dianhydride (BPDA) monomer is ...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08J5/18C08G73/10
CPCC08J5/18C08G73/1071C08G73/1003C08J2379/08
Inventor 沈国强
Owner 无锡高拓新材料股份有限公司
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