Grinding method combining mechanical reciprocation and supersonic vibration

A technology of ultrasonic vibration and grinding method, which can be used in ultra-finishing machines, metal processing equipment, manufacturing tools, etc., can solve the problems of low grinding efficiency, ensure flatness and smoothness, expand the scope of use, improve grinding and polishing quality and effect of effect

Inactive Publication Date: 2009-02-11
HYPIC SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] The purpose of the present invention is to provide a mechanical reciprocating and ultrasonic vibration compound grinding method to solve the problem that the existing mechanical reciprocating grinding and polishing can only realize the po

Method used

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  • Grinding method combining mechanical reciprocation and supersonic vibration
  • Grinding method combining mechanical reciprocation and supersonic vibration
  • Grinding method combining mechanical reciprocation and supersonic vibration

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0031] Example 1:

[0032] like image 3 As shown, a composite grinding method of mechanical reciprocation and ultrasonic vibration, comprising at least two grinding processes, using grinding heads 4 of different hardness and abrasives 5 of different particle diameters between each grinding process, and the hardness of the grinding heads 4 is from the order of the grinding process. From hard to soft, the particle diameter of abrasive 5 changes from large to small according to the order of the grinding process. In each grinding process, the same grinding head is driven to grind the surface of the workpiece by superimposing mechanical reciprocating vibration and ultrasonic vibration, as shown in Figure 2. As shown, an ultrasonic generating device is coaxially arranged on the main shaft (not shown in the figure) of the hand-held grinding and polishing machine 9, and simultaneously acts on the same grinding head 4 to grind the surface 6 of the machined workpiece, and the grinding h...

Example Embodiment

[0035] Embodiment 2:

[0036] As shown in Figure 4, a mechanical reciprocating and ultrasonic vibration composite grinding method differs from Embodiment 1 in that the direction of mechanical reciprocation and the direction of ultrasonic vibration are superimposed at an acute angle in a plane parallel to the surface of the workpiece; in Figure 4 Arrow 4 and arrow 5 represent the directions of ultrasonic vibration and mechanical reciprocating motion respectively; others are the same as the first embodiment, and are not described in detail here. In addition, the mechanical reciprocating motion direction and the ultrasonic vibration direction are superimposed at an obtuse angle, which is the same, and will not be described in detail here.

Example Embodiment

[0037] Embodiment 3

[0038] As shown in FIG. 5 , a composite grinding method of mechanical reciprocation and ultrasonic vibration includes at least two grinding processes. The difference from Embodiment 1 is that the direction of mechanical reciprocation and the direction of ultrasonic vibration are in a plane parallel to the surface of the workpiece. They are superimposed at right angles; arrows 4 and 5 in FIG. 5 represent the directions of ultrasonic vibration and mechanical reciprocating motion respectively; others are the same as those in the first embodiment, and will not be described in detail here.

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Abstract

The invention relates to a composite grinding method of mechanical reciprocation and ultrasonic vibration. The superposition method of the mechanical reciprocation vibration and the ultrasonic vibration is adopted in the grinding procedure to drive the identical grinding head to grind the surface of a processed work piece, wherein, the mechanical reciprocation vibration and the ultrasonic vibration are superposed according the following motion parameters: the mechanical reciprocation vibration direction and the ultrasonic vibration direction are coaxially superposed, or the mechanical reciprocation vibration direction and the ultrasonic vibration direction are superposed inside the plane parallel to the surface of the processed work piece with an included angle; the frequency of the mechanical reciprocation vibration is 30 Hz to 300 Hz, and the frequency of the ultrasonic vibration is 20 KHz to 50 KHz; the amplitude of the mechanical reciprocation vibration is 0.1 to 10 mm, and the amplitude of the ultrasonic vibration is 0.02 to 0.05 times of the mechanical reciprocation vibration. The grinding method solves the problem that only the polishing of the work piece with a large area can be realized by the existing mechanical reciprocation grinding polishing, and only the polishing of the surface with a small area such as a corner, a slit, a narrow side, a quirk, and a die cavity with complex shape can be realized by the ultrasonic grinding polishing, and the grinding efficiency is low.

Description

technical field [0001] The invention belongs to the technical field of workpiece surface finishing, and in particular relates to a grinding method combined with mechanical reciprocation and ultrasonic vibration. The compound grinding method is especially suitable for a portable grinder. Background technique [0002] The rapid development of modern industry puts forward higher requirements on the surface quality of the workpiece. The surface quality not only affects the appearance of the workpiece, but also directly affects the performance and life of the workpiece. The quality of the surface is especially important for molds. The mold is a tool for manufacturing parts in the way of re-image. The surface roughness has become an important symbol to measure the quality of the mold product. Only when the surface roughness of the mold is low can the roughness value of the product processed by it be low. Therefore, grinding and polishing has become an important means of surface pr...

Claims

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Application Information

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IPC IPC(8): B24B1/04B24B35/00
Inventor 姚兴姚文翰
Owner HYPIC SUZHOU
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