Method for marking wafer, method for marking poor product crystal grain, method for wafer contraposition, and wafer test machine

Abstract

The invention provides a method for marking a wafer, which comprises providing a wafer having at least two reference marks, wherein a surface of the wafer comprises a plurality of crystal grains, at the same time, detecting the reference marks of the wafer to perform a wafer alignment, and marking the wafer by a laser. In addition, the invention can be suitable for marking the crystal grains of the wafer (for example, throwout crystal grains), comparing to the prior art of marking the throwout crystal grains by ink, has advantages of less wafer pollution, operation time, workshop space and permanent marker, is easier to reconstruct by the existing wafer tester or ink machine platform.

Description

technical field [0001] The invention relates to a method for marking a wafer, and in particular relates to a method for marking inferior crystal grains by using laser light. Background technique [0002] The general integrated circuit manufacturing process can be divided into the wafer manufacturing stage, the die testing stage and the die packaging stage in sequence. As the current electronic products are light and thin, the current packaging technology is designed to reduce the packaging volume and improve the performance of integrated circuits. It has gradually tended to high-end packaging technologies such as flip-chip packaging and multi-chip modules. However, these high-end packaging methods are expensive. These inferior chips are eliminated to save unnecessary packaging costs. [0003] A wafer-free ink dot test method can generate a wafer image (MAP) after the wafer test, as the basis for the packaging of each die. The method of die marking is easy to cause mistakes...

AI Technical Summary

Problems solved by technology

[0007] In view of the above problems, an object of the present invention is to solve problems such as the difficulty in controlling the size of ink dots in the existing ink marking process, the easy contamination of wafers, and the long operating time. However, due to the shortening of operating time, the number of machines required It is also reduced, which can effectively save the workshop space

[0009] Another object of the present invention is to propose a method for permanently marking wafers or inferior grains to effectively solve the problem that existing ink marks are easily blurred or difficult to identify due to factors such as the environment or time, so that the wafer must be washed The problem of re-marking the process afterward

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