Thin film transistor, and active matrix substrate and display device provided with such thin film transistor
A technology for thin film transistors and substrates, applied in transistors, electric solid state devices, semiconductor devices, etc., can solve problems such as the degradation of display quality, and achieve the effect of improving current driving capability
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Embodiment approach 1
[0074] figure 1 2 and 2 show the liquid crystal display device 100 of this embodiment. figure 1 is a plan view schematically showing one pixel region of the liquid crystal display device 100, and FIG. 2 is along the figure 1 The cross-sectional view of line 2A-2A' in.
[0075] The liquid crystal display device 100 includes an active matrix substrate (hereinafter referred to as a "TFT substrate") 100a, an opposing substrate (also referred to as a "color filter substrate") 100b opposed to the TFT substrate 100a, and interposed therebetween. Liquid crystal layer 60 .
[0076] The TFT substrate 100a has a transparent insulating substrate (for example, a glass substrate) 10, a plurality of scanning wirings 11 formed on the substrate 10, an insulating film 12 covering these scanning wirings 11, and multiple scanning wirings 11 crossing the insulating film 12. signal wiring 13 .
[0077] The TFT substrate 100a further has, in each pixel region: a thin film transistor (TFT) 14 tha...
Embodiment approach 2
[0122] Figure 13 and Figure 14 A thin film transistor (TFT) 14 of this embodiment is schematically shown. In the TFT 14 of the present embodiment, as Figure 13 and Figure 14 As shown, the channel region 17c is formed in an L-shape.
[0123] Also in the L-shaped TFT 14 having such a structure, by covering the edge of the gate electrode 14G with the first insulating layer 12a, the occurrence of leakage between the source electrode / drain electrode and the gate electrode can be suppressed.
[0124] In addition, by setting the relative arrangement relationship between the semiconductor layer 17 and the low-stack region 12R so that the current path always passes through the portion of the semiconductor layer 17 above the low-stack region 12R, an effect of improving the off characteristic can be obtained. For example, in Figure 13 In the shown structure, by forming the low stack region 12R in an L-shape, the width of the low stack region 12R along the channel width directio...
Embodiment approach 3
[0127] Figure 15 and Figure 16 The TFT 14 of this embodiment is schematically shown. The TFT14 of this embodiment, such as Figure 15 and Figure 16 As shown, there are two drain electrodes 14D, and a source electrode 14S is arranged between these two drain electrodes 14D. When such a structure is adopted, even if the alignment shift of the photomask occurs, the change in the gate-drain capacitance can be canceled between the two drain electrodes 14D, so the gate-drain capacitance as a whole of the TFT 14 can be suppressed. change in capacitance.
[0128] In the TFT 14 having such a structure, by covering the edge of the gate electrode 14G with the first insulating layer 12a, the occurrence of leakage between the source / drain layer and the gate electrode layer can be suppressed. In addition, by setting the relative arrangement relationship between the semiconductor layer 17 and the low stack region 12R so that the current path always passes through the portion of the se...
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