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Condenser microphone using the ceramic package whose inside is encompassed by metal or conductive materials

A condenser microphone, microphone technology, applied in piezoelectric effect/electrostrictive or magnetostrictive motors, metal processing equipment, coupling of optical waveguides, etc., to reduce ESD effect, reduce EMI effect, improve electrical characteristics and audio frequency Effects of Features

Inactive Publication Date: 2009-03-11
BSE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Condenser microphones using ceramic packages have problems with these EMI effects and ESD effects

Method used

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  • Condenser microphone using the ceramic package whose inside is encompassed by metal or conductive materials
  • Condenser microphone using the ceramic package whose inside is encompassed by metal or conductive materials
  • Condenser microphone using the ceramic package whose inside is encompassed by metal or conductive materials

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Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] Hereinafter, the present invention will be described in detail with reference to the drawings.

[0033] figure 1 is a sectional view of the condenser microphone using the ceramic package of the first embodiment of the present invention. figure 2 It is an exploded perspective view of the condenser microphone using the ceramic package of the first embodiment of the present invention. refer to figure 1 and figure 2 , the MEMS microphone chip 130 is packaged together with the circuit unit 150 . Here, the MEMS microphone chip 130 functions to convert a sound source flowing from the outside into an electric signal. The electric signal is transmitted to the circuit unit 150 along the electric wire 170 . The circuit unit 150 plays a role of amplifying the received electric signal with an internal IC chip and outputting it to the outside.

[0034] In the present invention, the MEMS microphone chip 130 and the circuit part 150 are located on the substrate 180 . In this c...

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PUM

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Abstract

Provided is a condenser microphone. The condenser microphone includes: a substrate disposed on a micro electro mechanical system (MEMS) microphone chip and a circuit part; a package having a ring shape and disposed on the substrate, the package surrounding the MEMS microphone chip and the circuit part; an insertion part having a ring shape and formed of a conductive material, the insertion part being attached to an inner wall of the package; and an upper plate completely covering the package, the upper plate having an acoustic hole through which sound passes. In addition, the condenser microphone includes: a substrate disposed on a MEMS microphone chip and a circuit part; a package disposed on the substrate and covering the MEMS microphone chip and the circuit part, the package having an acoustic hole through which sound passes; and an insertion part attached to an inner wall of the package, the insertion part being formed of a conductive material.

Description

technical field [0001] The present invention relates to condenser microphones. Specifically, the present invention relates to the following technology: inserting metal or other conductive substances on the inner surface of the ceramic package of the condenser microphone, and grounding the electric wave, thereby reducing ESD (Electro Static Discharge: electrostatic discharge) effect and EMI (Electro Magnetic Interference: electromagnetic interference) effect. Background technique [0002] A typical microphone is a converter that converts audio energy into electrical energy. Microphones are roughly divided into electrodynamic microphones (Electro dynamic Microphone) and condenser microphones (Condenser Microphone). [0003] Here, the electrodynamic microphone utilizes induced electromotive force, and has a magnet capable of forming a certain magnetic field inside the microphone and a coil connected to a vibrating plate and flowing inside the magnetic field. This electrodyna...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81B7/00B81B7/02H04R19/01H04R19/04B81C3/00H04R31/00
CPCH01L2224/48137H01L2224/48091H04R19/04H01L2924/1461Y10T29/49005H01L2924/00014H01L2924/00
Inventor 朴成镐秋伦载
Owner BSE CO LTD