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Lateral wall insulation method of electrode for minuteness electrochemical processing

A technology of electrochemical machining and side wall insulation, applied in the direction of machining electrodes, electric machining equipment, electrode manufacturing, etc., can solve problems such as difficult operation and complicated process, and achieve the advantages of avoiding damage, wide application range, and strong process controllability Effect

Inactive Publication Date: 2010-06-02
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method is complicated and difficult to operate. Even if there is a protective medium, the process of grinding or removing the protective substance will inevitably cause damage to the fine electrodes and insulating film.

Method used

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  • Lateral wall insulation method of electrode for minuteness electrochemical processing
  • Lateral wall insulation method of electrode for minuteness electrochemical processing
  • Lateral wall insulation method of electrode for minuteness electrochemical processing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] 1. Clean the array electrode 1

[0041] The specific cleaning process is: ① deionized water, ultrasonic cleaning at room temperature for 10 min; ② 200 g / L HCl, room temperature cleaning for 30 s; then rinse with deionized water; ③ acetone (analytical grade), room temperature ultrasonic cleaning for 10 min, repeat 3 times; Rinse with deionized water; ④ 50g / L NaOH, ultrasonic cleaning at 50°C for 5 minutes; then rinse with 60°C deionized water, repeat rinsing twice; ⑤ 200g / L hydrochloric acid, wash at room temperature for 30s; then rinse with deionized water; ⑤ Acetone (analytical grade), ultrasonic cleaning at room temperature for 10 minutes; ⑦ ethanol (analytical grade), ultrasonic cleaning at room temperature for 10 minutes; ⑧ Take out the array electrodes and place them in a dust-free environment to dry naturally.

[0042] 2. Coating liquid epoxy resin insulation material on the surface of the array electrode by spin coating method

[0043] The liquid insulating materi...

Embodiment 2

[0054] 1. Clean the array electrode 1

[0055] The specific cleaning process is: ① deionized water, ultrasonic cleaning at room temperature for 10 min; ② 200 g / L HCl, room temperature cleaning for 30 s; then rinse with deionized water; ③ acetone (analytical grade), room temperature ultrasonic cleaning for 10 min, repeat 3 times; Rinse with deionized water; ④ 50g / L NaOH, ultrasonic cleaning at 50°C for 5 minutes; then rinse with 60°C deionized water, repeat rinsing twice; ⑤ 200g / L hydrochloric acid, wash at room temperature for 30s; then rinse with deionized water; ⑥ Acetone (analytical grade), ultrasonic cleaning at room temperature for 10 minutes; ⑦ ethanol (analytical grade), ultrasonic cleaning at room temperature for 10 minutes; ⑧ Take out the array electrodes and place them in a dust-free environment to dry naturally.

[0056] 2. Coating liquid epoxy resin insulation material on the surface of the array electrode by spin coating method

[0057] The liquid insulating mate...

Embodiment 3

[0069] 1. Clean single electrode

[0070] The specific cleaning process is: ① deionized water, ultrasonic cleaning at room temperature for 10 min; ② 200 g / L HCl, room temperature cleaning for 30 s; then rinse with deionized water; ③ acetone (analytical grade), room temperature ultrasonic cleaning for 10 min, repeat 3 times; Rinse with deionized water; ④ 50g / L NaOH, ultrasonic cleaning at 50°C for 5 minutes; then rinse with 60°C deionized water, repeat rinsing twice; ⑤ 200g / L hydrochloric acid, wash at room temperature for 30s; then rinse with deionized water; ⑥ Acetone (analytical grade), ultrasonic cleaning at room temperature for 10 minutes; ⑦ ethanol (analytical grade), ultrasonic cleaning at room temperature for 10 minutes; ⑧ Take out the single electrode and place it in a dust-free environment to dry naturally.

[0071] 2. Coating liquid epoxy resin insulation material on the surface of a single electrode by spin coating method

[0072] The liquid insulating material ado...

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Abstract

Disclosed is a side wall insulation method of an electrode for electrochemical micro-machining, which relates to a method for forming an insulation film on the side wall surface of the electrode for electrochemical micro-machining, and belongs to the technique field of micro-machining. The method comprises the operational steps: 1) cleaning the electrode; 2) coating liquid state insulation material on the electrode surface by a spin-coating method; 3) removing the liquid state insulation material on the end face of the electrode by utilizing the partial dissolution method, so as to make the end face be conductive; 4) solidifying the liquid state insulation material; and 5) repeating the step 2), the step 3) and the step 4) for a plurality of times, and forming the insulation film with certain thickness on the side wall surface of the electrode so as to meet the requirements of side wall insulation. The insulation material can adopt an epoxy resin liquid. The invention is applied to single electrodes as well as array electrodes for electrochemical micro-machining, meanwhile providing a novel side wall insulation method to electrodes used in electrophysiological experiments.

Description

technical field [0001] The invention relates to a side wall insulation method of an electrode for micro-electrochemical machining, which belongs to the technical field of micro-machining. Background technique [0002] As a typical microstructure, the micro-array holes of metal and alloy materials have been widely used in MEMS, aerospace, precision instruments, chemical fiber and other fields, such as high-speed printer nozzle plate, optical fiber connector, chemical fiber spinneret, micropump microstructure in etc. Micro electrochemical machining has the characteristics of no electrode loss, no stress, no influence on the mechanical properties of tools and workpiece materials, complex shapes can be processed on conductive materials, and the surface finish after processing is high. In precision and micro array holes It has potential application prospects in processing. However, since electrochemical machining is based on the principle of electrochemical dissolution or depos...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23H3/04B23H3/06C08J3/24C08L63/00
Inventor 李勇刘改红陈旭鹏
Owner TSINGHUA UNIV