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LED display packaging method

A technology of LED display and packaging method, which is applied in the direction of instruments, identification devices, semiconductor devices, etc., can solve the problems of affecting the luminous effect of LED displays, uneven light output of LED displays, and irregular shapes of molding cavities, so as to improve uniformity and Operational efficiency, reduction of remaining amount, and convenient operation

Active Publication Date: 2009-04-08
JIANGSU WENRUN OPTOELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0012] The disadvantages of this method are: since the epoxy resin has a certain viscosity (mixed viscosity 500-700CPS / 30°C), the permeability is poor; When inside, the package bracket or the substrate is in contact with the epoxy resin. Due to the existence of surface tension, the package bracket or the substrate is not easy to be infiltrated by the epoxy resin, and it is very easy to generate air bubbles on the surface of the package bracket or the substrate, resulting in poor light output of the LED display. Uniformity, affecting the luminous effect of the LED display

Method used

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Embodiment Construction

[0028] The present invention will be further described below in conjunction with the drawings.

[0029] As shown in the figure, in order to solve the above technical problems, an LED display packaging method of the present invention includes the following steps: a. Provide a packaging support or substrate, insert pins on the periphery of the packaging support or substrate, and then use a mold to compress or Soldering with tin wire to form adjacent first electrode and second electrode to meet the requirements of external connection after installation; b. Bonding, prepare insulating glue or silver glue on the bottom electrode of the LED chip and expand it after expansion. The chip is placed on the crystal piercing table, and the dies are mounted one by one on the corresponding pads on the package support or substrate with a crystal pen under the microscope, and then sintered to solidify the silver glue. The temperature of the silver glue sintering is generally controlled at 150°C, s...

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PUM

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Abstract

The invention disclosures a packaging method of an LED display. The packaging method comprises the following steps: a. providing a packaging support or a base plate; b. die bonding; c. wire bonding; and d. sealing. The sealing comprises steps as follows: d1. a forming die chamber which is matched with the packaging support or the base plate is selected; d2. liquid epoxy resin is potted in the forming die chamber; d3. the packaging support or the base plate is filtered in industrial acetone; d4. the packaging support or the base plate is taken out and dried; d5. the packaging support or the base plate is slantwise put in the forming die chamber and is compressed; and d6. the packaging support or the base plate is baked to solidify the epoxy resin. The packaging method can effectively control the generation of gas bubble, and has the advantages of high operation efficiency and simple operation. LED displays packaged by the method provide uniform light.

Description

Technical field [0001] The invention relates to a packaging method, in particular to a packaging method of an LED display. Background technique [0002] LED display integrates microelectronics technology, computer technology, and information processing. With its bright colors, wide dynamic range, high brightness, long life, stable and reliable work, it has become the most advantageous new generation of display media. With the continuous progress of large-scale integrated circuits and computer technology, LED displays are rising rapidly. At present, LED displays have been widely used in large squares, commercial advertisements, stadiums, information dissemination, press releases, securities trading, etc., which can meet different environments Needs. [0003] Conventional packaging methods for existing LED displays: [0004] a. Select a suitable package support or substrate, put pins on the periphery of the package support or substrate, and then press it with a mold or solder with ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/50H01L21/56H01L33/00G09F9/33
Inventor 包书林
Owner JIANGSU WENRUN OPTOELECTRONICS
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