Method for manufacturing afebrile array wave-guide grating based on flat-plate wave-guide movement

Abstract

The invention discloses a method for manufacturing an afebrile array wave-guide grating based on flat-plate wave-guide movement, which comprises the following steps that a common silicon-based silica array wave-guide grating chip is divided into a first part and a second part along a cutting line for inputting a flat-plate wave guide or a cutting line for outputting the flat-plate wave guide on the array wave-guide grating chip; a temperature compensating rod spans the cutting line of the array wave-guide grating chip and is fixed with the surfaces of the first part and the second part of the array wave-guide grating chip; and the expansion and contraction of the temperature compensating rod drive the first part and the second part to move relatively, so as to compensate wavelength shift caused by the temperature and manufacture the afebrile array wave-guide grating. The method doses not adopt a substrate. The first part a and the second part b are placed on a six-axes precision fine tuning bracket to be fully and freely adjusted in six directions; the device cost is reduced; the processing steps are simplified to the maximum degree so that the manufacture of the device is easy to implement; deterioration of the performance of the device is reduced to the maximum degree; and the stability is strong.

Description

technical field [0001] The invention relates to a temperature-insensitive arrayed waveguide grating. In particular, it relates to the manufacture of an athermal arrayed waveguide grating based on the movement of a slab waveguide, which uses the thermal expansion and contraction of the temperature compensation rod to drive the relative movement of the two parts a and b of the arrayed waveguide grating chip, thereby compensating the wavelength drift caused by temperature. method. Background technique [0002] As the continuous growth of IP data services and the emergence of various broadband access services have brought about unlimited demands on bandwidth, Dense Wavelength Division Multiplexing (DWDM) technology has been flourishing. The multiplexer and demultiplexer are the key devices in the DWDM system. At present, there are devices with various structures that can realize the wavelength division multiplexing function, such as thin film interference filters, acousto-optic...

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Problems solved by technology

[0012] Realizing the athermal characteristic of AWG, there are other schemes, which are limited to a small number of literature reports. These methods are not described here because of their poor practicability.

[0013] Existing technologies based on slab waveguide movement such as figure 1 , 2 As shown, the following patents Patent No.: US 6470119 B1, Patent No.: US 6798948 B2, Patent No.: US 6865323 B2, Patent No.: US 6961498 B2, Patent No.: US 6563986 B2, Patent No.: US 6735364 B2, Patent No.: US 8626332 B2, Patent No.: US 6954566 B2, Patent No.: US 6975793 B2, Patent No.: US 6668116 B2, Patent No.: US 6668117 B2, Patent No.: US 6490395 B1 , WO 2006 / 073229 A1, CN1302131A, and CN1392961A are athermal arrayed waveguide grating schemes based on the movement of slab waveguides. The characteristics of the scheme are summarized as follows: 1) There is a substrate 11 under the relatively moving part a and part b, and the substrate 11 has Larger size, greatly increases device cost and device size

2) Either part a and part b are kept in the state before cutting after cutting, and there is no coupling adjustment, but it is extremely difficult to maintain the state before cutting, especially the sub-micron changes in the height direction can cause spectral Great deterioration; either part a and part b are re-aligned for optical coupling after cutting, but due to the existence of the substrate 11, the degree of freedom of re-coupling is greatly limited, and the contact surface between the substrate 11 and part a and part b There are extremely high requirements for smoothness, flatness and cleanliness

Due to the high requirements on the tolerance of the manufacturing process, the yield is low and the cost of the device is high, which is not conducive to large-scale production

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