Low melting point alloy thermal interface material and radiating module applying same

A thermal interface material, low melting point technology, applied in cooling/ventilation/heating transformation, electrical components, circuits, etc., can solve problems such as leakage of hot melt droplets

Active Publication Date: 2011-03-30
IND TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Different use environments may make the influence of gravity more significant. For example, as shown in FIG. When the gravity of the hot-melt droplet is greater than the adsorption force between the metal droplet and the surrounding material, the hot-melt droplet will leak downward

Method used

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  • Low melting point alloy thermal interface material and radiating module applying same
  • Low melting point alloy thermal interface material and radiating module applying same
  • Low melting point alloy thermal interface material and radiating module applying same

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Embodiment Construction

[0035] The advantages and spirit of the present invention, as well as more detailed implementations, can be further understood through the following implementations and drawings.

[0036] Please refer to FIG. 2A , which is a schematic diagram of an embodiment of the heat dissipation module of the present invention. The heat dissipation module 20 of the present invention can quickly transfer the heat generated by an electronic component 22 to the external environment. The heat dissipation module 20 includes a heat sink 21 and a low melting point alloy foil 24 . As shown in the figure, the heat sink 21 is disposed above the electronic component 22 , and the low melting point alloy foil 24 is disposed between the electronic component 22 and the heat sink 21 , and serves as a thermal interface material between the electronic component 22 and the heat sink 21 . In addition, the electronic components 22 are disposed on a circuit board 23 and are electrically connected to each other....

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Abstract

The invention relates to a low-melting-point indium alloy heat interface material having low-heat impedance characteristic, which is formed by indium element and one or several of bismuth, tin and zinc, and the melting temperature is between 55 and 85 DEG C, and the thickness of the material is not more than 0.04mm.

Description

technical field [0001] The invention relates to a low-melting-point alloy foil and a heat dissipation module using the low-melting-point alloy foil as a thermal interface material. Background technique [0002] Constructing microelectronic components, such as high-brightness light-emitting diodes and central processing units, etc., due to the development trend towards high power, high speed and / or miniaturization, the high heat flux generated by microelectronic components must be removed to maintain the junction temperature below its safe operating temperature. Once the junction temperature of the microelectronic element exceeds the safe operating temperature, the performance of the microelectronic element will be degraded, or the microelectronic element will be damaged, seriously affecting the service life and reliability of the electronic element. [0003] Along with the heat dissipation requirements of microelectronics and electronic components, the diversification and t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20H01L23/36H01L23/373C22C12/00C22C13/00C22C18/00C22C28/00C22C30/00
Inventor 范元昌陈俊沐苏健忠翁震灼黄振东萧复元林成全
Owner IND TECH RES INST
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