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Impurity removal device and removal method for chemical tinning solution

A technology of electroless tin plating and removal device, applied in chemical instruments and methods, liquid chemical plating, water/sludge/sewage treatment, etc., can solve problems such as environmental pollution, inability to remove copper ions, and addition of pretreatment steps.

Inactive Publication Date: 2009-05-06
HWABEAK ENG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0009] In order to solve the above problems, people have proposed to introduce a pretreatment step to reduce the amount of antimony trioxide dissolved in the plating solution. However, the above process not only increases the manufacturing cost due to the increase of the pretreatment step, but also has The strong acids such as hydrochloric acid and sulfuric acid used in the process will cause environmental pollution, and there is no way to remove the copper ions generated during the metal plating process

Method used

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  • Impurity removal device and removal method for chemical tinning solution
  • Impurity removal device and removal method for chemical tinning solution

Examples

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no. 1 example

[0053] As shown in Table 1, when the electroless tin plating solution is not delivered to multiple compartments but is contained in one compartment, the current density applied to the anode plate / cathode plate is 0.05A / dm 2 To 1.00A / dm 2 The current is 12 hours or 24 hours in total.

[0054] The composition of the metal film deposited on the anode plate / cathode plate after applying the above current was analyzed by an electron microscope.

[0055] With current density of 0.05A / dm 2 As an example, when the current is supplied for 12 hours, the initial concentration of antimony ions is 200 ppm, and the initial concentration of copper ions is 0.5 g / L.

[0056] After 12 hours, the concentrations of antimony and copper ions in the anode plate / cathode plate were 3% and 6%, respectively, and the concentrations of antimony and copper ions in the final solution were 150 ppm and 0.4 g / L, respectively.

[0057] Therefore, antimony ions are reduced by 50 ppm, and copper ions are reduced by 0....

no. 2 example

[0059] Correct figure 1 The impurity removal device for electroless tin plating solution shown has a supply current density of 0.5A / dm 2 The current is used to deliver the plating solution at a delivery speed of 10L per minute.

[0060] The initial concentration of antimony ions in the plating solution is 200 ppm, and the initial concentration of copper ions is 1 g / L.

[0061] When measuring after 24 hours of impurity removal process, antimony ions were removed by about 90%, and copper ions were removed by about 50%.

[0062] The method for removing impurities in the electroless tin plating solution of the present invention will be further described below.

[0063] First, the tin plating solution from the electroless tin plating unit 50 flows into the interior of the multiple compartments 10; then, the current density is greater than 0.05A / dm applied to the anode plate and the cathode plate inside the compartment 10 2 And less than 10A / dm 2 The current, preferably, the current den...

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Abstract

The present invention discloses an impurity removing device which is used for chemical tin plating solution and a method thereof. The removing device comprises the following components: a plurality of chambers which are arranged continuously and communicated with one another; an impurity removing unit which is installed in the chamber and comprises an anode plate and a cathode plate; and a power sullying unit which supplies power for the impurity removing unit, wherein the electric current density of current supplied by the power supplying unit is larger than 0.05A / dm<2> and is lower than 10A / dm<2>. Additionally, the impurity removing method used for chemical tin plating solution according to the invention comprises the following steps: putting chemical tin plating solution into the plurality of chambers that are arranged continuously and communicated with one another; and flowing over the impurity removing unit which is installed in the chamber and comprises the anode plate and the cathode plate, wherein the electric current density of current supplied to the impurity removing unit is larger than 0.05A / dm<2> and is lower than 10A / dm<2>.

Description

Technical field [0001] The invention relates to an impurity removal device and a removal method, in particular to an impurity removal device and method for a plating solution used in electroless plating that does not require electric energy. Background technique [0002] Electroless plating, also called electroless plating, is a method of plating metal by using the reducing agent component in the plating solution to perform a reduction reaction and deposit metal. [0003] The electroless tin plating solution is an acidic plating solution containing thiourea (Thiourea). Its purpose is to prevent the oxidation of copper or copper alloys and improve the soldering characteristics of electronic parts. The electroless tin plating solution reacts with copper to achieve replacement Electroless tin plating. [0004] In the above-mentioned displacement metal plating process, copper is decomposed into an ionic state, and the ionized copper must be dissolved in the plating solution. [0005]...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/52C02F1/461C02F103/16
CPCC23C18/1619C23C18/1628C23C18/1683C23C18/1689C23C18/31
Inventor 李刚洪石杓朴光姿张种官崔敏廷
Owner HWABEAK ENG