Glass substrate laser cutting apparatus

A glass substrate and cutting technology, which is applied in glass cutting devices, glass production, glass manufacturing equipment, etc., can solve the problems of uneven cutting surface and increase the cost of consumables, so as to reduce the operation cycle, increase the workload, and prevent cutting Cutting precision and safety reduction effect

Active Publication Date: 2009-05-27
SAMSUNG CORNING PRECISION MATERIALS CO LTD
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Problems solved by technology

[0005] In order to solve the above-mentioned various problems, the present invention provides a laser cutting device for glass substrates. The purpose of the present invention is to solve the generation of cutting particles generated in the conventional recording wheel system. In order to remove them, other cleaning processes and drying must be additionally provided. The disadvantage of increasing the cost of consumables due to the unevenness of the process and cutting surface

Method used

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  • Glass substrate laser cutting apparatus
  • Glass substrate laser cutting apparatus
  • Glass substrate laser cutting apparatus

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Embodiment Construction

[0040] figure 1 It is a three-dimensional view of the overall structure of the glass substrate laser cutting device of the present invention, Figure 2a and 2b They are the side view of the glass substrate laser cutting device showing the stage structure moving along the stage platform, and the front view of the glass substrate laser cutting device showing the laser irradiation head moving along the stage structure.

[0041] refer to figure 1 and Figure 2a , 2b , the glass substrate laser cutting device of the present invention has:

[0042] The cutting table 120 keeps the glass substrate to be cut in a horizontal state;

[0043] A pair of stand platforms 50 are assembled in parallel at both ends of the cutting table 120 in order to move the stand structure 60;

[0044] The platform structure 60 is vertically arranged on the top of the platform 50 and perpendicular to the platform 50, and can move along the platform 50;

[0045] The laser emitting part 100 is fixedly arr...

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Abstract

Glass substrate cutting apparatuses using lasers are disclosed, where a laser cutting head is moved. A glass substrate cutting apparatus includes two parts for a laser cutting head: heavy laser oscillation parts fixed to respective ends of a gantry structure moving in parallel along two gantry stages located on either side of a cutting table, and relatively lightweight laser irradiation heads moving horizontally in parallel with the gantry structure. The glass substrate cutting apparatus includes a cutting table for maintaining a glass substrate in a horizontal state; biaxial gantry stages for moving a gantry structure along the cutting table; the gantry structure moving in between an upper part of the biaxial gantry stages; laser oscillation parts fixed to respective ends of the gantry structure for oscillating the laser; and laser irradiation heads that move horizontally on respective ends of the gantry structure and irradiate the laser upon the glass substrate.

Description

technical field [0001] The present invention relates to a laser cutting device for glass substrates, in particular to a stand structure that uses a pair of stand platforms assembled in parallel on the left and right sides of the cutting table to fix and maintain a certain relative position for positional movement. Laser cutting device for glass substrate. Furthermore, among the components of the laser cutting head of the laser cutting device for glass substrates, the laser emitting parts such as the laser emitting source and the power supply with a large weight are fixed at both ends of the stand, and other parts with a relatively small weight will be provided. The unit’s beam delivery system (Beam Delivery System), beam shaping (Shaping) mirror, quenching nozzle (Quenching Nozzle), initial cracker (Initial Cracker) and other laser irradiation heads can move left and right along the platform structure Assemble. As mentioned above, the laser cutting head is separated into two...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03B33/09B23K101/40H05K3/00
CPCC03B33/091C03B33/03B65G49/067C03B33/027B65G49/064C03B33/033Y10T225/325Y02P40/57B23K2103/54
Inventor 李宪植李昌夏郑熏相卢亨祥金泰皓
Owner SAMSUNG CORNING PRECISION MATERIALS CO LTD
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