Building material board filled with organic polymer binder or inorganic adhesive

A technology of inorganic adhesives and polymers, applied in building materials, buildings, building structures, etc., can solve the problem of low strength and achieve the effect of increased strength

Inactive Publication Date: 2009-05-27
TERALONG BUILDING MATERIALS SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problem that the strength of the existing building material board is not high because the board body material is filled with micropores, the present invention provides a building material board filled with an organic polymer adhesive or an inorganic adhesive in the board body, which can make the board strength enhancement of

Method used

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Embodiment Construction

[0007] The organic polymer binder of the present invention can adopt one or several kinds of organic monomer methyl acrylate and unsaturated polyester resin and add an appropriate amount of additives to form a liquid state. If it needs to be diluted, a diluent can be used. Among the additives, Include initiator such as dibenzoyl peroxide, curing agent such as phthalic anhydride, accelerator such as N, N-dimethylaniline; inorganic binder of the present invention can adopt sodium silicate (also known as water glass) , Sulfur after melting, all in liquid state. When it is necessary to fill the whole board with adhesive, put the board into the pool where the adhesive solution has been stored for dipping, and after the adhesive infiltrated into the board is cured, it becomes an embodiment of the present invention, the whole building material The strength of the board is increased; when it is necessary to fill the adhesive in a certain geometric shape in the board, it is only necess...

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Abstract

The invention provides a building material plate of which a plate body is filled with an organic polymer bonding agent or an inorganic bonding agent. The plate comprises a fiber reinforced calcium silicate plate or fiber reinforced cement plate, wherein the plate body is fully or locally filled with the organic polymer bonding agent or the inorganic bonding agent, and the bonding agent infiltrates gaps of micropores of the plate body and is bonded with solid particles on the periphery of the plate body; after solidification, a bonding body with hard and firm texture is formed, so that the strength of the plate body is increased; and when the plate is used as a ceiling plate, the phenomenon that the ceiling plate is bent downward due to poor strength is not occured.

Description

technical field [0001] The invention relates to a building material board, in particular to a building material board filled with an adhesive in the board. Background technique [0002] Existing building material boards, such as fiber reinforced calcium silicate boards or fiber reinforced cement boards, are full of microporous voids in the board material, which affects the strength of the board. When this board is used as a ceiling board, it often occurs due to insufficient strength. The problem of body sagging adds trouble to the construction and affects the construction quality. Contents of the invention [0003] In order to solve the problem that the strength of the existing building material board is not high because the board body material is filled with micropores, the present invention provides a building material board filled with an organic polymer adhesive or an inorganic adhesive in the board body, which can make the board strength enhancement. [0004] The bu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): E04C2/02E04F13/08
Inventor 李俊雄
Owner TERALONG BUILDING MATERIALS SUZHOU
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