Adhesive sheet for producing semiconductor device, semiconductor device, and production method for semiconductor device
A manufacturing method, semiconductor technology, applied in the direction of semiconductor/solid-state device manufacturing, semiconductor devices, adhesive types, etc., can solve the problem of reduced adhesion between lead frame and packaging resin, reduced yield of semiconductor devices, poor bonding of bonding wires, etc. Problems, to achieve the effect of excellent adhesion, excellent reliability, and no glue residue
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Embodiment 1～4 and comparative example 1～5
[0178] As shown in Table 1 below, adhesives were prepared, adhesive sheets were prepared, and the obtained adhesive layers or adhesive sheets were evaluated.
[0179] That is, the composition and compounding ratio (parts by mass) shown in Table 1 were mixed in toluene to prepare a binder solution. Then, as a heat-resistant base material, a polyimide resin film (manufactured by Toray DuPont Co., Ltd., trade name: Kapton 100EN, with a thickness of 25 μm, a glass transition temperature of 300° C. or above, and a thermal expansion coefficient of 16 ppm / °C), the above-mentioned adhesive solution was coated thereon so that the thickness after drying was 6 μm, and then dried at 120 °C for 5 minutes to obtain an adhesive sheet having an adhesive layer.
[0180] Next, each of the above-mentioned evaluations of defective wire bonding, flashing, glue residue, adhesive strength, and outgassing measurement was performed on the obtained adhesive sheet. The evaluation results are shown in ...
Embodiment 5、6 and 8
[0204] Mix in toluene according to the composition and mixing ratio (parts by mass) shown in Table 4 to prepare a binder solution. Then, as a heat-resistant base material, a polyimide resin film (manufactured by Toray DuPont Co., Ltd., trade name: Kapton 100EN, with a thickness of 25 μm, a glass transition temperature of 300° C. or above, and a thermal expansion coefficient of 16 ppm / °C), the above-mentioned adhesive solution was coated thereon so that the thickness after drying was 6 μm, and then dried at 120 °C for 5 minutes to obtain an adhesive sheet having an adhesive layer.
Embodiment 7、10 and 11
[0206] The adhesive sheet of the present invention was obtained in the same manner as in Example 5, except that the adhesive solution was prepared by mixing in methyl ethyl ketone with the composition and compounding ratio shown in Table 4.
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Abstract
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