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Manufacture method of Ti-based MEMS mechanical relay

A technology of metal titanium and relays, applied in the direction of relays, metal material coating technology, and technology for producing decorative surface effects, etc., to achieve the effect of low cost, high precision, and high aspect ratio

Inactive Publication Date: 2009-06-03
PEKING UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is no mature method for the processing of metal micromechanical relays with high aspect ratios

Method used

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  • Manufacture method of Ti-based MEMS mechanical relay
  • Manufacture method of Ti-based MEMS mechanical relay

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Experimental program
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Embodiment Construction

[0018] Below in conjunction with accompanying drawing and specific embodiment the present invention is described in further detail:

[0019] 1. Preparation of the substrate: choose titanium substrate as the structural material; choose a glass substrate with a thermal expansion coefficient matching that of the titanium substrate (the thermal expansion coefficient is 8.6-9.4ppm / °C) as the substrate, such as D263T glass (7.2), soda lime glass ( 9.4), FOTURAN glass (8.6), B270 glass (9.4), etc.

[0020] 2. The surface of the titanium substrate is photolithographically patterned and etched to form shallow grooves, such as 5-10 μm deep, such as figure 1 (a).

[0021] 3. Deposit a layer of metal on the surface of the glass, such as 200nm gold, copper, etc., and pattern it by photolithography to form metal connections, such as figure 1 (b).

[0022] 4. Anodic bonding of titanium substrate and glass substrate, such as figure 1 (c), the bonding parameters are: temperature 350-450°C,...

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Abstract

The invention discloses a manufacture method of a Ti-based MEMS mechanical relay, which belongs to the field of MEMS micromachining technology. The method comprises the following steps: patterning a Ti substrate by photolithography to form shallow grooves; selecting glass with a thermal expansion coefficient matched with that of Ti, and preparing a metal connection line on the glass surface; subjecting the Ti substrate and the glass substrate to anodic bonding; and thinning the back of the Ti substrate, patterning by photolithography, and deep-etching to break through the Ti substrate to form the MEMS mechanical delay. By anodic bonding, chemical-mechanical polishing and deep etching, the method can manufacture a three-dimensional Ti movable structure with low cost, high accuracy and high depth-to-width ratio on the glass substrate, thereby obtaining the Ti-based MEMS mechanical relay.

Description

technical field [0001] The invention relates to the micro-processing technology of micro-electro-mechanical system (MEMS), in particular to a method for preparing a titanium-based MEMS mechanical relay. Background technique [0002] Micromechanical relays rely on mechanical movement to achieve relay control of signal transmission lines, and have advantages that CMOS relays cannot match, such as low insertion loss, high linearity, and high isolation. With the development of MEMS (micro-electro-mechanical systems) technology, it is possible to integrate micro-mechanical structures including relays / relays in large quantities, at low cost, and at high density on the same substrate, but currently MEMS relays use silicon as a structural material , the silicon material itself has poor electrical conductivity, so it is necessary to form a layer of metal on the contact surface of the side wall. It is difficult to complete the side wall coverage by ordinary deposition methods. It can...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01H49/00B81C1/00
CPCH01H1/0036B81C1/00547B81B2201/018
Inventor 陈兢舒琼
Owner PEKING UNIV