Wafer kit, monitoring system and method for semi-conductor production process

Abstract

Disclosed are a monitoring system for the production process of wafer cassettes and semiconductors and a method thereof. The monitoring system for the production process of semiconductors comprises a shock sensor, a receiving device and a recording device, wherein the shock sensor is mounted on a wafer cassette body, and outputs alarming signals when the shock strength of the wafer cassette surpasses the preset shock strength, the receiving device receives the alarming signals output by the shock sensor and outputs shock information of the wafer cassette, and the recording device records the shock information of the wafer cassette output by the receiving device. The monitoring system for the production process of wafer cassettes and semiconductors and the method thereof can reduce pollution of wafers, and can increase the yield of semiconductor products.

Description

technical field [0001] The invention relates to a semiconductor production process, in particular to a wafer box and a monitoring system and method for the semiconductor production process. Background technique [0002] The manufacturing process of semiconductor products needs to go through many process steps, and each process step is completed by the corresponding process machine. When a batch of wafers is completed on a process machine, the robotic arm (Arm) of the process machine will place the batch of wafers into the wafer pod (Wafer Pod), and then the operator will move the wafer pod from the The process machine is moved to the storage system, and then the wafer box is transferred to the next process machine through the storage system and the transportation system. The robotic arm of the next process machine takes the wafer out of the wafer box and transfers it to the process machine. The process reaction is carried out in the reaction chamber, and the wafer is transf...

AI Technical Summary

Problems solved by technology

The vibration of the wafer box will cause the dust on the wafer box to fall on the wafer in the wafer box, thus contaminating the wafer

After the wafer is polluted by fine dust, it is likely to produce defects, resulting in process failure and wafer damage or scrapping, which will directly affect the yield of semiconductor products and consume a lot of production costs

[0005] What's more serious is that if the vibration of the wafer box is too severe during the process of moving and placing the wafer box, it will also cause the wafers in the wafer box to break or even fragment, and the broken wafer particles will remain in the wafer. In the wafer box, the next batch of wafers placed in the wafer box will be polluted; and the robotic arm will also be polluted by broken wafer particles when transferring wafers, and the polluted robotic arm will also pollute other wafers. Cassettes and wafers placed in them

The consequences of such interlocking pollution are incalculable. Not only will the yield rate of semiconductor products be greatly reduced, but once the process is abnormal or fails, the process machine must be shut down for maintenance, so the entire production time will also be delayed.

Images