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Preparation of spherical silicon dioxide

A technology of spherical silica and silicon dioxide, which is applied in the direction of silica and silicon oxide, can solve the problems of high cost, high equipment requirements, and unstable product quality, and achieve high ball forming rate, good dispersibility, The effect of engineering stability and high reliability

Inactive Publication Date: 2009-06-24
ZHEJIANG HUAFEI ELECTRONICS BASE MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the above two methods have disadvantages such as high equipment requirements, high cost, and unstable product quality.

Method used

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  • Preparation of spherical silicon dioxide
  • Preparation of spherical silicon dioxide

Examples

Experimental program
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Effect test

Embodiment 1

[0037]Example 1: Choose silica raw materials and grind them to obtain angular silica particles through physical actions such as mutual collision and shearing. The obtained angular silica granules are put into the silica granule hopper 1 . As shown in Figures 1 and 2, the pipelines of natural gas, oxygen, and silica particles are connected to the combustion furnace 2, and the oxygen, natural gas, and silica particles used for combustion enter the combustion furnace through the same nozzle 3, and the nozzle 3 has an internal Layer 3a, middle layer 3b, and outer layer 3c are composed of three layers, wherein the inner layer 3a is connected to the silica particle hopper 1, the middle layer 3b is connected to natural gas, and the outer layer 3c is connected to oxygen. In this embodiment, the feed rate of oxygen is 2.3 times that of natural gas (the ratio of the amount of substances). The internal space of the combustion furnace 2 is a cylinder with a diameter of 3m and a height of...

Embodiment 2

[0039] Embodiment 2: The difference between this embodiment and Example 1 is that the feed rate of the oxygen is 3.2 times of the feed rate of natural gas, and the inside of the combustion furnace is a cylinder with a height of 15 m between 6 m; The residence time of the silica in the flame is 0.6s; the silica particles in this embodiment are sent into the combustion furnace by compressed air.

[0040] Table 1

[0041]

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Abstract

The invention relates to a method for preparing fine spherical granular silicon dioxide. The method comprises the steps of passing angular silicon dioxide through the combustion flame of natural gas and oxygen, passing the angular silicon dioxide through a cooling region and grading particles. The method adopts pure oxygen and natural gas which are the energy with low price, uses high-temperature flame to melt angular silicon dioxide particles, and spheroidizes the silicon dioxide through surface tension after melting. As the pure oxygen and the natural gas are large in flow, the silicon dioxide particles can be effectively dispersed, the clustering possibility of the silicon dioxide particles of which the surfaces are melted is reduced and the sphericity of final products is guaranteed.

Description

technical field [0001] The invention relates to a preparation method of fine spherical granular silicon dioxide. Background technique [0002] SiO 2 It is widely used in the plastic packaging industry, and SiO 2 , resin, curing agent, flame retardant, and other additives are mixed with a special process to make a plastic sealant, and the packaging factory then uses the plastic sealant to package electronic components, such as diodes, triodes, integrated circuits and other electronic components. SiO 2 It accounts for 60%-90% of the plastic packaging compound, so it is an important material for the plastic packaging compound. [0003] Angular SiO 2 Mainly packaging diodes, triodes and other electronic components, the market demand is large, the domestic demand is about 20,000-30,000 tons per year, and it is still growing at a rate of 20% every year. The price per ton is only more than 1300-1500 yuan, and the price is very high. Low. Due to angular SiO 2 The production p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C01B33/18
Inventor 李文熬洲钱军
Owner ZHEJIANG HUAFEI ELECTRONICS BASE MATERIAL
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