Thermal conductivity coefficient measurement instrument for solid material

A measuring device and thermal conductivity technology, which is applied in the field of material thermal conductivity testing, can solve problems such as errors in the theoretical system constant current measurement scheme, and achieve the effect of reducing production costs

Inactive Publication Date: 2009-06-24
NAT INST OF METROLOGY CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this method assumes that the total power of the system is constant in the measurement process, and the obtained theoretical system and corresponding constant current measurement scheme are all wrong.

Method used

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  • Thermal conductivity coefficient measurement instrument for solid material
  • Thermal conductivity coefficient measurement instrument for solid material
  • Thermal conductivity coefficient measurement instrument for solid material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] refer to figure 1 The top view of the structure of the heating chip of the present invention shown, figure 2 with image 3 givesfigure 1 The schematic diagram of the enlarged structure of local area A and local area B in the middle and the size of the heating wire are marked in the figure, the unit in the figure is mm, and the material selected for the heating plate is a 20 μm thick pure nickel plate.

[0047] from figure 1 It can be seen from the figure that a solid material thermal conductivity measurement device of the present invention includes: a heating plate 101, and the heating plate 101 includes: a first heat band 102, a second heat band 103, and a third heat band 105 distributed side by side; The hot 102 band and the third hot band 105 respectively comprise a rectangular groove made of nickel material, and the second hot band 103 comprises two rectangular grooves (such as image 3 As shown), the rectangular groove is made of nickel material, the length is ...

Embodiment 2

[0052] The measurement principle of the constant current source measurement device and the corresponding measurement device are described in detail below in conjunction with the accompanying drawings:

[0053] refer to figure 1 The schematic diagram of the structure of the heating plate of the present invention is shown. This embodiment uses a constant current method to provide energy to the heating plate, that is, in Figure 4 A constant current is loaded between points A and D of the shown Wheatstone bridge, and the structure of the measurement device for the thermal conductivity of the constant current source is as follows: Figure 5 As shown, it includes a constant current source 005 that provides energy for the heating chip 101, and the upper and lower surfaces of the heating chip 101 are respectively connected to the same material to be tested 004 and the material to be tested 002 (in this embodiment, the material to be tested 004 and the material to be tested are 002 i...

Embodiment 3

[0090] The measurement principle of the constant voltage source measurement device and the corresponding measurement device are described in detail below in conjunction with the accompanying drawings:

[0091] In this embodiment, a stable voltage is used to provide energy to the heating plate, so as to obtain another experimental measurement device and corresponding measurement principle for measuring thermal conductivity. The structure of the heating plate is as figure 1 as shown in Figure 7 As shown in the present invention, the load constant voltage source and the combined schematic diagram of the measurement device in the absolute measurement mode, this device is the same as the above-mentioned constant current source measurement device; when the constant current source loads the heating plate, as Figure 8 The equivalent circuit diagram shown is analyzed;

[0092] When the material to be tested is measured with a constant voltage source measuring device, the measuremen...

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Abstract

The invention provides a device for measuring the coefficient of heat conductivity of a solid material. The device comprises a heating plate, wherein, the heating plate comprises a first hot band, a second hot band and a third hot band which are distributed side by side; the first hot band includes a rectangular groove, and the third hot band includes a rectangular groove; the second hot band includes two rectangular grooves; all the rectangular grooves are made of nickel and are electrically connected with each other in the form of wheatstone bridge; and the measuring device further includes a power supply for providing two opposite nodes of the heating plate with constant energy, and a data acquisition system which is connected with the heating plate and used for collecting information about changes in voltage and temperature of other two opposite nodes in the heating plate, thereby obtaining the heat conductivity coefficient and the thermal diffusion coefficient of the material to be tested. The measuring instrument is capable of measuring the coefficient of heat conductivity from a heat insulating material to a metal material in a very short period of time, with the range of the obtained heat conductivity coefficient being 0.01-300Wm<-1>K<-1> and the uncertainty of the heat conductivity coefficient obtained within 5%.

Description

technical field [0001] The invention relates to the technical field of measuring thermal conductivity of materials, in particular to a thermal conductivity measuring device for solid materials. Background technique [0002] The physical parameter for evaluating the thermal insulation performance of a material is the thermal conductivity of the material itself, and its reciprocal determines the thermal resistance of the material. This is a thermal physical parameter that plays a decisive role in evaluating the thermal insulation performance of a material; Parameters have important uses in the fields of chemical engineering, materials, energy, power and refrigeration engineering, and are essential basic data in many industrial processes and product designs. With the rapid development of modern industry, the measurement of thermal conductivity of solid materials has been paid more and more attention by people. [0003] The thermal conductivity of a substance can be obtained th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N25/20
Inventor 林鸿张金涛薛寿清
Owner NAT INST OF METROLOGY CHINA
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