Encapsulation structure for power-supply module

Abstract

The invention discloses a packaging structure of a power supply module and at least comprises a circuit carrier, a power supply converter and a plurality of contact pads; the circuit carrier is provided with a top surface and a bottom surface which are opposite to each other; the power supply converter is arranged on the circuit carrier and comprises at least a packaged semiconductor chip; the semiconductor chip is arranged at the top surface of the circuit carrier; at least part of the contact pads are electrically connected with the power supply converter; and the contact pads are substantially equal in area. The packaging structure of the power supply module is provided with a plurality of contact pads with substantially equal area, so that the production line can be easily arranged on the system circuit board through the surface adhesion technology, and the power supply module can take up less space inside the electronic equipment, and the electronic equipment can further miniaturized. In addition, the semiconductor chip packaged inside the power supply module can not be easily damaged ion the power supply module packaging process so as to improve the product reliability.

Description

technical field [0001] The invention relates to a packaging structure, in particular to a packaging structure of a miniaturized power supply module. Background technique [0002] With the advancement of technology and the development of industries, electronic devices have been widely used in daily life or work. Generally speaking, electronic equipment must rely on a power module (power module), such as a power converter (power converter), to convert an input voltage into a voltage required by the electronic equipment, so that the electronic equipment can operate. [0003] Please refer to FIG. 1 , which is a schematic structural diagram of a known power module. As shown in the figure, the known power module 1 is usually provided with a plurality of electronic components 11 on one side of the circuit board 10, and a plurality of conductive parts 12 connected with the plurality of electronic components 11 are provided on the other opposite side. , wherein a plurality of elect...

AI Technical Summary

Problems solved by technology

[0006] The main purpose of the present invention is to provide a packaging structure of a power module, which solves the problem that the conventional power module has a thick structure when the power module is installed on the system circuit board of the electronic device, occupying a large amount of power inside the electronic device. space, leading to the disadvantage that electronic equipment cannot be further miniaturized

[0007] Another object of the present invention is to provide a power module, which is convenient for the production line to install the power module on the system circuit board, and solves the problems that the traditional power module is difficult to assemble to the system circuit board and may cause poor welding.

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