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Technique for producing encapsulating material for high-power LED support frame

A technology for LED brackets and encapsulation materials, which is used in the manufacture of electrical components, circuits, semiconductor/solid-state devices, etc., to achieve the effects of high flame retardancy, excellent thermal stability, and high electrical insulation.

Active Publication Date: 2011-03-23
四川耐锐德特种工程塑料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006]The traditional encapsulating plastic is nylon reinforced modified material, and the modified composite material based on nylon has relatively high temperature resistance, aging resistance, impact resistance and insulation performance. Not ideal, it is often not easy to withstand a short-term high temperature of 260°C during the manufacturing process of the lamp or in the welding process of the light source, which will lead to a decrease in the aging insulation performance and even failure of the lamp

Method used

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  • Technique for producing encapsulating material for high-power LED support frame
  • Technique for producing encapsulating material for high-power LED support frame
  • Technique for producing encapsulating material for high-power LED support frame

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Using the above as figure 1 Technological process, the molecular weight is 3 +- Put 200kg of Wan's polyphenylene sulfide resin into the thermal crosslinking machine, the temperature is controlled at 230°C, and after 4 hours of crosslinking with oxidative heat, add 0.2kg of polyoxystyrene ether phosphate diethylamine, 10kg of styrene-based three Ethoxysilane, 0.2kg of magnesium oxide, and 10kg of polyphenylester (paraben) powder with a particle size of 1um, 40kg of nano-scale silicon dioxide, and 0.2kg of antioxidant GK-1010 are stirred in a high-speed mixer Evenly, in this way it is mixed into a premix containing polyphenylene sulfide. The obtained premix and 40kg of glass fiber with a single fiber diameter of 15um after being treated with KH550 surface treatment agent are mixed and extruded by a co-rotating twin-screw extruder, cooled, pelletized, and the injection molding temperature is 290 ° C. The mold temperature is 80 ℃ injection molding machine injection molde...

Embodiment 2

[0024] Set the molecular weight to 4 +- Add 100kg of Wan's polyphenylene sulfide resin into the thermal crosslinking machine, the temperature is controlled at 200°C, and after 8 hours of crosslinking with oxidative heat, add 0.5kg of polyoxystyrene ether phosphate triethylamine and 3.3kg of styrene base Stir trimethoxysilane, 0.2kg of magnesium carbonate, 10kg of polyphenylene ester micropowder with a particle size of about 2.4um, 20kg of nanoscale silicon dioxide, and 0.2kg of antioxidant GK-1010 in a high-speed mixer. The obtained premix and 30kg of glass fibers with a single fiber diameter of 15um after being treated with KH550 surface treatment agent were mixed and extruded by a co-rotating twin-screw extruder, cooled, pelletized, and the injection molding temperature was 300°C and the mold temperature was 90°C. ℃ injection molding machine injection molded into LED forming brackets.

[0025] Various performance characteristics of the LED forming bracket made of polyphenyl...

Embodiment 3

[0027] Using the above as figure 1 Technological process, the molecular weight is 5 +- Add 100kg of Wan's polyphenylene sulfide resin into the thermal cross-linking machine, the temperature is controlled at 210°C, and after 6 hours of cross-linking with oxidative heat, add 0.9 kg of polyoxystyrene ether phosphate triethylamine and 3.9 kg of styrene-based Trimethoxysilane, 0.4kg of magnesium carbonate, and 15kg of polyphenylene ester micropowder with a particle size of about 4.4um, 23kg of nanoscale silicon dioxide, and 0.6kg of antioxidant GK-1010 are stirred evenly in a high-speed mixer, so that they are mixed into Containing polyphenylene sulfide as a premix. The obtained premix and 23kg of glass fiber with a single fiber diameter of 15um after being treated with KH550 surface treatment agent were mixed and extruded by a co-rotating twin-screw extruder, cooled, pelletized, and the injection molding temperature was 310°C and the mold temperature was 120°C. ℃ injection mold...

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Abstract

The invention relates to a high-power LED support bracket and frame encapsulating material and a production process thereof. After 8 hours of oxidized thermal crosslinking of 100 mass units of polyphenylene sulfide (PPS) resin with 30,000-80,000 molecular weight at 200 DEG C, additives, 5-15 mass units of PHB micro powders and 10-30 mass units of nanoscale inorganic filler are added in a homogenizer and stirred evenly, so as to obtain the PPS resin compound premix; through a co-rotating twin-screw extruder, the compound premix is mixed with alumina ceramic fiber whiskers or 20-30 mass units of glass fiber processed with KH550 surface treating agent to complete the mixing extrusion, and the single fiber diameter of the glass fiber is 15 micron; finally, through ejection molding, an LED support bracket is molded with an injection molding machine with the injection molding temperature reaching 290-320 DEG C and the die temperature reaching 90-120 DEG C. The support bracket produced in the invention is provided with good high-temperature resistance, insulation and aging-resistance, and is especially suitable for high-power LED support bracket and frame encapsulating materials.

Description

technical field [0001] The invention belongs to the field of synthetic material manufacturing for high-power LED encapsulation brackets. Background technique [0002] High-power LED solid-state lighting is the most important lighting revolution since the invention of the incandescent lamp. Semiconductor LED materials can directly convert electrical energy into light energy, which is the biggest difference from traditional lighting sources. It has high luminous efficiency and energy consumption is only one-eighth of ordinary incandescent lamps; long life; no flicker, no infrared and ultraviolet radiation and It does not contain mercury elements, etc., and is a typical energy-saving, green and environmentally friendly lighting. [0003] With the advancement of technology and the continuous expansion of market scale, the power density and luminous efficiency of a single high-power LED are constantly improving, and higher requirements are also put forward for high-power LED pa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00H01L21/48B29C45/78C08L81/02C08L67/00C08K13/04C08K3/26C08K3/36C08K3/22C08K7/08
Inventor 宋大余杜生民宋小春
Owner 四川耐锐德特种工程塑料有限公司
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