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Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method

A technology for testing equipment and optical components, which is applied in the field of inspection and can solve problems such as aggravating errors

Inactive Publication Date: 2009-07-15
ASML NETHERLANDS BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] 2. The phase modulator is wavelength dependent, which means that for each wavelength used the phase modulator has to be recalibrated
And several devices in series can exacerbate even small errors that exist in a single of these devices

Method used

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  • Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
  • Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
  • Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method

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Embodiment Construction

[0037] Figure 1a A lithographic apparatus is schematically shown. The apparatus comprises: an illumination system (illuminator) IL configured to condition a radiation beam B (e.g., ultraviolet radiation or deep ultraviolet radiation); a support structure (e.g., a mask table) MT configured to support a patterning device (e.g., mask) MA and is connected to a first positioner PM configured to precisely position the patterning device according to determined parameters; a substrate table (e.g. wafer table) WT configured to hold a substrate (e.g. coated with a resist agent wafer) W connected to a second positioner PW configured to precisely position the substrate according to determined parameters; and a projection system (such as a refractive projection lens system) PL configured to The pattern imparted by the patterning device MA to the radiation beam B is projected onto a target portion C of the substrate W (eg, comprising one or more dies).

[0038] The illumination system ma...

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PUM

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Abstract

A system is configured to measure two separately polarized beams upon diffraction from a substrate in order to determine properties of the substrate (30), in particular to measure parameters of a lithographic pattern on the substrate. Elliptically polarized light from a light source is reflected from the surface of the subtrate and passed via a fixed phase retarder (100) in order to change the phase of one of two orthogonally polarized radiation beams with respect to the other of the two beams. The relative phases of the two radiation beams and other features of the beams as measured in a detector allows to determine properties of the substrate surface.

Description

technical field [0001] The present application relates to an inspection method, for example, used in a manufacturing process for manufacturing a device by photolithography, and to a method of manufacturing a device using photolithography. Background technique [0002] A lithographic apparatus is a machine that applies a desired pattern to a substrate, usually a target portion of the substrate. For example, lithographic equipment may be used in the manufacture of integrated circuits (ICs). In this case, a patterning device, alternatively referred to as a mask or reticle, may be used to generate the circuit pattern to be formed on the individual layers of the IC. The pattern can be imaged onto a target portion (eg, comprising a portion, one or more dies) on a substrate (eg, a silicon wafer). Typically, the pattern is transferred by imaging the pattern onto a layer of radiation sensitive material (resist) provided on the substrate. Typically, a single substrate will contain ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20H01L21/027
CPCG03F7/7085G03F7/70566G03F7/70616G03F7/70483
Inventor 亚历山大·斯卓艾杰尔
Owner ASML NETHERLANDS BV
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