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Planar antenna and manufacturing method thereof

A flat-panel antenna and a manufacturing method technology, applied to the structural form of the radiation element, etc., can solve the problems of affecting waste materials, producing chemical waste liquid, and complicated manufacturing processes, and achieve the effects of simplifying manufacturing procedures, avoiding environmental pollution, and saving manufacturing process time

Active Publication Date: 2012-06-27
WISTRON NEWEB
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In the above process, because the surface of the Teflon substrate is not easy to handle, chemical etching is required, which not only makes the process more complicated, but also produces chemical waste
In addition, the material cost of the Teflon substrate is expensive, and it is not easy to recycle. In the punching process of the Teflon substrate, a lot of non-recyclable waste is generated
[0005] Therefore, the current use of Teflon substrates to make flat panel antennas, in addition to complicated manufacturing processes and high production costs, also produces a lot of waste that affects the environment, which does not meet environmental protection requirements

Method used

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  • Planar antenna and manufacturing method thereof
  • Planar antenna and manufacturing method thereof
  • Planar antenna and manufacturing method thereof

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Embodiment Construction

[0065] The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of two preferred embodiments with reference to the accompanying drawings.

[0066] Before the present invention is described in detail, it should be noted that in the following description, similar components are denoted by the same numerals.

[0067] refer to figure 2 , illustrating the implementation process of the first preferred embodiment of the panel antenna and its manufacturing method of the present invention. Its detailed implementation steps are described as follows:

[0068] refer to image 3 , step 101 is to use a stamping process to form a first piece 211 with a predetermined shape on a metal plate (not shown in the figure). In this embodiment, the outer contour of the first piece 211 is roughly circular. Moreover, a first through hole 212 is stamped at the center of the first sheet 211 , and a fi...

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Abstract

A flat plate antenna comprises a medium layer, a radiation metal layer and a grounding metal layer. The medium layer is made by insulation materials with an upper surface, a lower surface and a through hole. The radiation metal layer is coated on the upper surface of the medium layer with a first sheet body, a first perforation corresponding to the through hole and a first protruding section outspreading from the first perforation periphery of the sheet body to the internal of the through hole. The grounding metal layer is coated on the lower surface of the medium layer with a second sheet body, a second perforation corresponding to the through hole and a second protruding section outspreading from the second perforation periphery of the second sheet body to the internal of the through hole. The first protruding section and the second protruding section are contacted in the through hole to electrically connecting the radiation metal layer and the grounding layer.

Description

technical field [0001] The invention relates to a flat-panel antenna for receiving satellite signals, in particular to a flat-panel antenna with a relatively simple manufacturing procedure and a manufacturing method thereof. Background technique [0002] At present, the common planar antenna structure for receiving satellite signals (frequency is about 2.32-2.3325GHz) on the market uses Teflon (Teflon) substrate as the dielectric layer, and a copper foil is pasted on both sides of the Teflon substrate. As the radiation layer and the ground layer, a through hole is formed in the center of the board, and the wall of the through hole is covered with a copper layer to electrically connect the radiation layer and the ground layer. [0003] like figure 1 As shown, the steps of the manufacturing process of the flat panel antenna containing the Teflon substrate include: step 901, cleaning the surface of the Teflon substrate, and eroding the surface with chemicals to activate it; st...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01Q1/38
Inventor 陈世宏徐杰圣黄章修张继中
Owner WISTRON NEWEB