Micro-channel heat sink for semi-conductor laser

A micro-channel and laser technology, applied in the direction of semiconductor lasers, lasers, laser parts, etc., can solve the problems of difficult production, poor mechanical strength and high cost, reduce the difficulty of connection and processing cost, improve heat dissipation capacity, and increase mechanical strength. the effect of strength
CN101488640AInactive Publication Date: 2009-07-22SHANXI FEIHONG MICRO NANO PHOTOELECTRONICS SCI & TECH
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
SHANXI FEIHONG MICRO NANO PHOTOELECTRONICS SCI & TECH
Publication Date
2009-07-22
Estimated Expiration
Not applicable Β· inactive patent

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Abstract

The invention relates to a semiconductor laser microchannel heat sink which belongs to the semiconductor optoelectronic technical filed. To improve unfavorable situations of poor structural performance, great process difficulty, high cost and the like of the high power semiconductor laser microchannel heat sink, the invention replaces the prior five-layer structure by three-layer, and then reduces difficulty and cost of fabrication, improves mechanical strength and improves the whole heat dispersion by utilizing altitude variation of microchannel wall. The new microchannel heat sink structure applies to the present preparation of any semiconductor laser embattle and stack arrays.
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Description

technical field

[0001] The invention relates to a microchannel heat sink structure for a semiconductor laser, belonging to the technical field of semiconductor optoelectronics. Background technique

[0002] At present, microchannel heat sinks for high-power semiconductor lasers generally use five layers of high thermal conductivity rectangular sheet materials with different internal hollow structures to form a microchannel heat sink structure. This structure requires precise processing of five layers of highly thermally conductive rectangular sheet materials, and then uses welding technology to accurately and tightly bond them together. This structure introduces additional thermal resistance due to the combination of the microchannel side wall (radiating fin) and the microchannel top wall (heat transfer layer) through welding technology, which greatly increases the overall thermal resistance of the structure; The four interfaces involve the welding process, which makes weld...

Claims

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