Wide groove shaped polysilicon gate associated transistor
A junction-gate transistor and polysilicon technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of avalanche breakdown and current accumulation in the current gathering area, and achieve the goal of increasing current density, improving uniformity, and reducing the difficulty of production process. Effect
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[0031] exist image 3 In the embodiment of the wide-slot polysilicon connected-gate transistor shown, the lower layer 42 of the silicon substrate 4 is the collector, which is N with a thickness of 420 μm and a resistivity of 0.01Ω·cm. + type silicon, the upper layer 41 is the collector region, which is N with a thickness of 60 μm and a resistivity of 35Ω·cm - type silicon. A plurality of parallel elongated grooves 5 are formed on the upper surface of the silicon substrate 4, the width of the grooves 5 is 4 μm, the depth of the grooves 5 is 3 μm, and the distance between two adjacent grooves 5 is 20 μm. The bottom of the groove is formed by implanting boron ions and advancing + Type high-concentration trench gate region 6, the surface concentration of boron is 1E19-2E20 / cm 3 , a junction depth of 10 μm. The upper surface of the upper layer 41 of the silicon substrate is implanted and diffused with boron ions to form a P-type base region 2, and the surface concentration of b...
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