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Wide groove shaped polysilicon gate associated transistor

A junction-gate transistor and polysilicon technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of avalanche breakdown and current accumulation in the current gathering area, and achieve the goal of increasing current density, improving uniformity, and reducing the difficulty of production process. Effect

Inactive Publication Date: 2009-08-05
李思敏 +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Tie-gate transistors with grooved gate polysilicon structure are often used in circuits with inductive loads such as electronic ballasts for energy-saving lamps. 5-7 times the current, if the slot width is narrow, it will cause more serious current accumulation phenomenon, which will lead to avalanche breakdown in the current accumulation area

Method used

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  • Wide groove shaped polysilicon gate associated transistor
  • Wide groove shaped polysilicon gate associated transistor
  • Wide groove shaped polysilicon gate associated transistor

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Embodiment Construction

[0031] exist image 3 In the embodiment of the wide-slot polysilicon connected-gate transistor shown, the lower layer 42 of the silicon substrate 4 is the collector, which is N with a thickness of 420 μm and a resistivity of 0.01Ω·cm. + type silicon, the upper layer 41 is the collector region, which is N with a thickness of 60 μm and a resistivity of 35Ω·cm - type silicon. A plurality of parallel elongated grooves 5 are formed on the upper surface of the silicon substrate 4, the width of the grooves 5 is 4 μm, the depth of the grooves 5 is 3 μm, and the distance between two adjacent grooves 5 is 20 μm. The bottom of the groove is formed by implanting boron ions and advancing + Type high-concentration trench gate region 6, the surface concentration of boron is 1E19-2E20 / cm 3 , a junction depth of 10 μm. The upper surface of the upper layer 41 of the silicon substrate is implanted and diffused with boron ions to form a P-type base region 2, and the surface concentration of b...

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Abstract

The invention discloses a wide groove shape polysilicon conjunction gate transistor; the upper layer of the transistor is a first conductive type high resistivity layer and the lower layer thereof is a first conductive type low resistivity layer; the upper surface of a silicon substrate slice has a plurality of emission zones of the first conductive type with high doping concentration, and a doped polysilicon layer is connected onto each emission zone and also connected with the metal layer of an emitter. The transistor is characterized in that the junction depth of the emission zone is larger than 1 mu m, the junction depth of a substrate area is 4.5-8 mu m, and the junction depth of a groove shape gate area is 6.5-12 mu m; the distance from two adjacent groove shape gate areas with high doping concentration to the interface thereof with the substrate area is less than 2.5 times of the difference between the distance from the bottom of the groove shape gate areas to the upper surface of the silicon substrate slice and the junction depth of the substrate area; and the width of the groove of the groove shape gate area is larger than 3.5 mu m. The invention has the advantages that the current density of the conjunction gate transistor is increased, the uniformity of the current distribution is improved, the capacity for fighting against avalanche breakdown is enhanced, the failure rate in application is lowered by 1-2 orders of magnitude, the production process difficulty is simultaneously reduced, and significant low cost as well as high performance price ratio effectiveness is realized.

Description

technical field [0001] The invention relates to a connected gate transistor, which belongs to the technical field of silicon semiconductor devices. Background technique [0002] In 1979, Hisao Kondo proposed the gate associated transistor GAT (Gate Associated Transistor), followed by a detailed analysis (see IEEETrans.ElectronDevice, v01.ED-27, PP.373-379.1980). In 1994, Chen Fuyuan, Jin Wenxin, and Wu Zhonglong made a further analysis of the connected gate transistor GAT (see "Power Electronics Technology", No. 4, 1994, 1994.11·pp52-55), and pointed out that the connected gate transistor G device exhibits high withstand voltage , fast switching and low saturation pressure drop and other excellent characteristics. [0003] The early connected-gate transistors GAT all adopt planar structure. In 2000, Chinese invention patent ZL00100761.0 (hereinafter referred to as patent 761) proposed a multi-gate transistor with a groove gate polysilicon structure. The principle of the st...

Claims

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Application Information

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IPC IPC(8): H01L29/06H01L29/739
Inventor (请求不公开姓名)
Owner 李思敏
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